HDI pcb manufacturing
10 layer Four stacked HDI Four times laminations with ENIG super thick 3.2mm board PCB Board Manufacturer.
Layer: | 10-layers PCB(with Blind & Buried Micro-Vias:L1-L2, L1-L3, L1-L4, L1-L5, L1-L6, L1-L7, L1-L8, L1-L9 ) | ||
Material: | FR4 G170 | Thickness: | 3.2mm |
Copper thickness: | 35μm | Surface finish: | ENIG |
Soldermask/Legend | Green/White | IPC Standard | IPC2 |
Unit size: | 203*178mm | Filled vias: | With resin |