Blind Vias Polyimide Rapid Prototype Rigid Flexible Pcb Boards
Layer: | 6-layers PCB(with blind vias:L1-2;L3-4 ) | ||
Material: | FR4 TG170 + PI | Cooper thickness: | 0.5/1 OZ |
Thickness: | 0.054″ | Surface finish: | ENIG |
Soldermaske/legend: | Green/White | Array size: | 3.077*4.357″(1UP ) |
Min copper holes: | 1mil | Leading time: | 15 working days |
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