PCB Capability Technology rigid plate process capability parameter table |
Item Name |
Technical Capability Parameter |
Material Type |
Ordinary Tg FR4 |
Biofine S1141&KB (not recommended for lead-free soldering process) |
Ordinary Tg FR4 (halogen free) |
Sheng Yi S1155 |
High Tg FR4 (halogen free) |
Bio-gain S1155 |
Material type used for HDI board |
LDPP (IT-180A 1037 and 1086), normal 106 and 1080 |
High CTI |
Bio-gain S1600 |
High Tg FR4 |
Isola: FR408, FR408HR, IS410, PCL-370HR; Lian Mao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic:R-5775K (Megtron6) R- 5725 (Megtron4) Taiyao:TU-768, TU-662; Tengfei:VT-47. |
Ceramic powder filled high frequency materials |
Rogers:Rogers4350、Rogers4003 |
Material mixing and pressing |
Rogers, Nelco and FR-4 |
Product Type |
Rigid boards |
Backplane, HDI, Multilayer Buried Blind Hole, Buried Capacitor, Buried Resistor, Thick Copper, Power Thick Copper, Semiconductor Test Board |
Stacking method |
Multiple press-fit blind buried hole board |
Same side press-fit ≤3 |
HDI board type |
1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated to fill holes |
Surface treatment |
Surface treatment type (lead-free) |
Electroplated cupro-nickel gold, submerged gold, hard gold plating (with/without nickel), gold finger plating, lead-free tin spraying, OSP, chemical nickel-palladium gold, soft gold plating (with/without nickel), submerged silver, submerged tin, ENIG+OSP, ENIG+G/F, full plate gold plating+G/F, submerged silver+G/F, submerged tin+G/F |
Surface treatment type (leaded) |
Tin spray with lead |
Thickness to diameter ratio |
10 1 (leaded/leadless sprayed tin chemically immersed nickel gold immersed silver immersed tin chemically immersed nickel palladium gold) 8 1 (OSP) |
Processed Size (MAX) |
Leaded sprayed tin |
Surface treatment type (with lead) |
Leaded tin spray 22"*39"; lead-free tin spray 22"*24"; gold finger plated 24"*24"; hard gold plated 24"*28"; chemically deposited gold 21"*27"; graphically plated copper-nickel-gold 21"*48"; deposited tin 16"*21"; deposited silver 16"*18"; OSP 24"*40"; |
Processing Size (MIN) |
Leaded tin 5"*6"; lead-free tin 10"*10"; gold finger 12"*16"; hard gold 3"*3"; copper-nickel gold 8"*10"; sunken tin 2"*4"; sunken silver 2"*4"; OSP 2"*2"; |
Processing plate thickness |
Leaded tin spray 0.6-4.0mm; lead-free tin spray 0.6-4.0mm; gold finger plating 1.0-3.2mm; hard gold plating 0.1-5.0mm; chemical gold plating 0.2-7.0mm; graphical copper-nickel gold plating 0.15-5.0mm; submerged tin 0.4-5.0mm; submerged silver 0.4-5.0mm; OSP 0.2-6.0mm; |
Golden finger height max |
1.5inch |
Minimum spacing between gold fingers |
6mil |
Minimum Segment Spacing Between Segmented Gold Fingers |
7.5mil |
Surface plating (overlay) thickness |
Tin spraying |
2-40um (0.4um for large tin surface with leaded spray tin, 1.5um for large tin surface with lead-free spray tin) |
OSP |
Film thickness: 0.2-0.6um |
Chemically immersed nickel gold |
Gold thickness 0.05-0.10um, nickel thickness 3-8um |
Chemical silver deposition |
Silver thickness 0.2-0.4um |
Chemically immersed tin |
Tin thickness ≥1.0 |
Hard gold plating |
Gold thickness 0.10-1.5um (dry film patterning process), gold thickness 0.10-4.0um (non-dry film patterning process) |
Soft gold plating |
Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non-dry film plating process) |
Chemical nickel-palladium gold |
Gold 0.05-0.10um thick, nickel 3-8um thick, palladium 0.05-0.15um thick |
Plating copper-nickel-gold |
Gold thickness 0.025-0.10um, nickel thickness ≥3um, base copper thickness max 1OZ |
Gold finger nickel gold plating |
Gold thickness 0.25-1.5um (required value refers to the thinnest point), nickel thickness ≥3um |
Carbon oil |
0.1-0.35mm |
Green oil |
Copper surface cover oil (10-18um), over-hole cover oil (5-8um), line corners ≥5um (once printed, copper thickness below 48um) |
Blue glue |
0.20-0.80mm |
Drilling |
0.1/0.15/0.2mm maximum plate thickness for mechanical drilling |
0.8mm/1.5mm/2.5mm |
Laser drilled holes min |
0.1mm |
Laser drilled hole diameter max |
0.15mm |
Machine hole diameter (finished) |
0.15-6.2mm (corresponds to drill cutter 0.2-6.3mm) |
Minimum finished hole diameter of PTFE material (including mixed pressure) plate 0.25mm (corresponds to drilling tool 0.35mm) |
Mechanically buried blind hole aperture ≤ 0.3mm (corresponds to drill cutter 0.4mm) |
Drilling diameter of green oil plug hole in disk ≤ 0.45mm (corresponding to drilling tool 0.55mm) |
Continuous hole bore diameter minimum 0.35mm (corresponding to drill cutter 0.45mm) |
Metallized half-hole bore diameter 0.30mm minimum (corresponds to 0.4mm for drill cutter) |
Through-hole plate thickness to diameter ratio max |
20:1 (excluding ≤0.2mm cutter diameter; >12:1 to be evaluated) |
Laser drilling depth to bore ratio max |
1:1 |
Mechanically controlled deep drilling blind hole depth hole diameter ratio max |
1.3:1 (hole diameter ≤ 0.20mm),1.15:1 (hole diameter ≥ 0.25mm) |
Mechanically controlled deep drilling (back drilling) depth minimum |
0.2mm |
Drilling-Minimum distance from mechanical drill hole to conductor (non-buried blind plate and first order laser blind hole) |
5.5 mil (≤8 layers); 6.5 mil (10-14); 7 mil (>14 layers) |
Drilling - minimum distance from mechanical drill hole to conductor (mechanical buried blind hole plate and second order laser buried blind hole) |
7 mil (primary press fit); 8 mil (secondary press fit); 9 mil (tertiary press fit) |
Drilling - minimum distance from mechanical drilling to conductor (blind laser buried holes) |
7mil(1+N+1);8mil(1+1+N+1+1或2+N+2) |
Drilling - laser drilling to conductor minimum body distance (1st and 2nd order HDI boards) |
5mil |
Drilling-minimum distance between different network hole walls (after compensation) |
10mil |
Drilling - minimum distance between hole walls of the same network (after compensation) |
6 mil (through hole; laser blind hole); 10 mil (mechanical blind buried hole) |
Minimum distance between drill hole-non-metallic hole walls (after compensation) |
8mil |
Drill hole-hole tolerance (compared to CAD data) |
±2mil |
Drill-NPTH hole bore tolerance min |
±2mil |
Drill-NPTH Hole Hole Diameter Accuracy |
±2mil |
Drill-Tapered Hole Depth Tolerance |
±0.15mm |
Drill-Tapered Hole Diameter Tolerance |
±0.15mm |
Pads (rings) |
Laser hole inner and outer pad size minimum |
10 mil (4 mil laser hole), 11 mil (5 mil laser hole) |
Minimal size of inner and outer pads for mechanical vias |
16 mil (8 mil hole size) |
BGA pad diameter minimum |
10mil for leaded solder spray process, 12mil for lead-free solder spray process, 7mil for other processes |
Pad Tolerance (BGA) |
+/-1.2mil (pads <12mil); +/-10% (pads ≥12mil) |
Wire width/spacing |
inner layer |
1/2OZ:3/3mil |
1OZ: 3/4mil |
2OZ: 4/5mil |
3OZ: 5/8mil |
4OZ: 6/11mil |
5OZ: 7/13.5mil |
6OZ: 8/15mil |
7OZ: 9/18mil |
8OZ: 10/21mil |
9OZ: 11/24mil |
10OZ: 12/27mil |
Outer layer |
1/3OZ-based copper: 3/3 mil |
1/2OZ-based copper: 3.5/3.5 mil |
1OZ-based copper: 4.5/5 mil |
1.43OZ-based copper (positive):4.5/6 |
1.43OZ-based copper (negative):5/7 |
2OZ-based copper: 6/7 mil |
3OZ-based copper: 6/10 mil |
4OZ-based copper: 7.5/13mil |
5OZ-based copper: 9/16mil |
6OZ-based copper: 10/19mil |
7OZ-based copper: 11/22mil |
8OZ-based copper: 12/26mil |
9OZ-based copper: 13/30mil |
10OZ-based copper: 14/35mil |
Line Width Tolerance |
≤10mil:+/-1.0mil |
>10mil:+/-1.5mil |
Solder resist character |
Maximum hole diameter for solder resist plug holes (both sides covered with oil) |
0.9mm |
Solder resist ink color |
Green, yellow, black, blue, red, white, purple, green matte |
Character Ink Colors |
white, yellow, black |
Maximum diameter of blue rubber aluminum plug hole |
5mm |
Resin plug hole drilling hole diameter range |
0.1-1.0mm |
Maximum thickness to diameter ratio of resin plug hole |
10:1 |
Solder resist character - minimum width of solder resist bridge |
Base copper ≤ 0.5 OZ, surface treatment with sunken tin: 7.5 (black), 5.5 (other colors), 8.0 (solder resist bridge on large copper surface) |
Base copper ≤ 0.5 OZ, other surface finishes other than sunken tin: 5.5 (black, limit 5), 4 (other colors, limit 3.5), 8.0 (large copper surface solder resist bridge) |
Base copper 1OZ: 4 (green), 5 (other colors), 5.5 (black, limit 5), 8.0 (solder resist bridge on large copper surface) |
Base copper 1.43oz: 4 (green), 5.5 (other colors), 6 (black), 8.0 (solder resist bridge on large copper surface) |
Base Copper 2-4OZ: 6, 8 (solder resist bridge on large copper surface) |
Profile |
Distance from the centerline of the V-CUT without copper leakage to the graph |
H≤1.0mm: 0.3mm (20° refers to V-CUT angle), 0.33mm (30°), 0.37mm (45°); |
1.0
< H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); |
1.6
< H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); |
2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); |
V-CUT symmetry tolerance |
±4mil |
Maximum number of V-CUT lines |
100 articles |
V-CUT angular tolerance |
±5 degrees |
Chemical nickel V-CUT angle specification palladium |
20、30、45degrees |
Golden finger chamfer angle |
20、30、45、60degrees |
Golden finger chamfering angle tolerance |
±5 degrees |
>Minimum distance of TAB without chamfering next to the gold finger |
6mm |
Minimum distance between the side of the gold finger and the edge line of the form |
8mil |
Controlled depth milling groove (edge) depth accuracy (NPTH) |
±0.10mm |
Outline dimensional accuracy (edge-to-edge) |
±4mil |
Minimum tolerance (PTH) for milled slot slot hole |
±0.13mm in both slot width and slot length direction |
Minimum tolerance (NPTH) for milling slotted holes |
±0.10mm in both slot width and slot length direction |
Minimum tolerance for drilling slotted holes (PTH) |
Slot width direction ±0.075mm; Slot length/slot width <2:Slot length direction +/-0.1mm; Slot length/slot width ≥2:Slot length direction +/-0.075m |
Minimum tolerance for drilling slotted holes (NPTH) |
±0.075mm in slot width direction; slot length/slot width
<2:slot length direction +/-0.1mm; slot length/slot width ≥2:slot length direction +/-0.075m |
Partial mixing pressure |
Minimum distance from drill hole to conductor in area of partial mixing pressure |
12 (local 10) mil |
Minimum distance from the junction of the local mixing pressure to the drill hole |
10mil |
Metal substrate |
Number of layers |
Aluminum substrate, copper substrate: 1-8 layers; |
Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) |
MAX:610*610mm、MIN:5*5mm |
Production size maximum (ceramic plate) |
100*100mm |
Finished plate thickness |
0.5-5.0mm |
Copper thickness |
0.5-10 OZ |
Metal base thickness |
0.5-4.5mm |
Metal base material |
AL: 1100/1050/2124/5052/6061; Copper: Purple copper pure iron |
Minimum finished bore diameter and tolerance |
NPTH: 0.5±0.05mm; PTH (aluminum substrate, copper substrate): 1.0±0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2±0.10mm; |
Profile machining accuracy |
±0.03mm |
PCB part surface treatment process |
Leaded/lead-free tin spraying; OSP; sunken nickel (palladium) gold; electric (nickel) soft/hard gold; electroplated tin; nickel-free electroplated soft/hard gold; thick gold fabrication |
Metal surface treatment |
Copper: nickel gold plating; aluminum: anodizing, hard oxidizing, chemical passivation; mechanical treatment: dry sandblasting, brushing |
Metal base material |
All-Power Aluminum Substrate (T-110, T-111); Tengai Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Beggs Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F); |
Thickness of thermally conductive adhesive (dielectric layer) |
75-150um |
Buried copper block size |
3*3mm—70*80mm |
Buried copper block flatness (drop accuracy) |
±40um |
Buried copper block to hole wall distance |
≥12mil |
Thermal conductivity |
0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic plate); |
Other |
Finished copper thickness max |
12 inner layer: 10 OZ; outer layer: 11 OZ |
Finished copper thickness of outer layer |
12, 18um base copper: ≥35.8 (reference: 35.8-42.5); ≥40.4 (reference: 40.4-48.5) |
35, 50, 70um base copper: ≥55.9; ≥70; ≥86.7 |
105, 140um base copper: ≥117.6; ≥148.5 |
Circuit Board Layer Count |
1-40 layers |
Finished board thickness |
0.20-7.0mm (without solder resist); 0.40-7.0mm (with solder resist); |
Plate thickness tolerance (conventional) |
Plate thickness ±10% (>1.0mm); ±0.1mm (≤1.0mm); |
Plate thickness tolerance (special) |
Plate thickness ±0.1mm (≤2.0mm); ±0.15mm (2.1-3.0mm) |
Finished size min |
10*10mm (without internal positioning splice design; up to 50*50 splice) |
Maximum finished size |
23*35inch (double-sided); 22.5*33.5inch (four-ply); 22.5*30 (≥six-ply); |
Ionic contamination |
≤1ug/cm2 |
Warp Limit Capability |
0.1% (This capability requires consistent stacked sheet type, strict symmetry in the stack, a residual copper rate difference of 10% or less in the symmetrical layer, uniform wiring, no concentrated large copper skins or substrates, no glossy or veneer panels in the stack, and a sputter size of ≤ 21 inches on the long side;)< |
Impedance tolerance |
±5Ω(
<50Ω),±10%(≥50Ω); |
plating fill laser blind hole aperture |
4-5 mil (4 mil preferred) |
Plating filler blind hole with maximum hole depth to hole diameter ratio |
1:1 (depth is the thickness of contained copper) |