process capability

SMT Capability
PCB Capability
PCB Capability Technology rigid plate process capability parameter table
Item Name Technical Capability Parameter
Material Type Ordinary Tg FR4 Biofine S1141&KB (not recommended for lead-free soldering process)
Ordinary Tg FR4 (halogen free) Sheng Yi S1155
High Tg FR4 (halogen free) Bio-gain S1155
Material type used for HDI board LDPP (IT-180A 1037 and 1086), normal 106 and 1080
High CTI Bio-gain S1600
High Tg FR4 Isola: FR408, FR408HR, IS410, PCL-370HR; Lian Mao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic:R-5775K (Megtron6) R- 5725 (Megtron4) Taiyao:TU-768, TU-662; Tengfei:VT-47.
Ceramic powder filled high frequency materials Rogers：Rogers4350、Rogers4003
Material mixing and pressing Rogers, Nelco and FR-4
Product Type Rigid boards Backplane, HDI, Multilayer Buried Blind Hole, Buried Capacitor, Buried Resistor, Thick Copper, Power Thick Copper, Semiconductor Test Board
Stacking method Multiple press-fit blind buried hole board Same side press-fit ≤3
HDI board type 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated to fill holes
Surface treatment Surface treatment type (lead-free) Electroplated cupro-nickel gold, submerged gold, hard gold plating (with/without nickel), gold finger plating, lead-free tin spraying, OSP, chemical nickel-palladium gold, soft gold plating (with/without nickel), submerged silver, submerged tin, ENIG+OSP, ENIG+G/F, full plate gold plating+G/F, submerged silver+G/F, submerged tin+G/F
Surface treatment type (leaded) Tin spray with lead
Thickness to diameter ratio 10 1 (leaded/leadless sprayed tin chemically immersed nickel gold immersed silver immersed tin chemically immersed nickel palladium gold) 8 1 (OSP)
Processed Size (MAX) Leaded sprayed tin
Surface treatment type (with lead) Leaded tin spray 22"*39"; lead-free tin spray 22"*24"; gold finger plated 24"*24"; hard gold plated 24"*28"; chemically deposited gold 21"*27"; graphically plated copper-nickel-gold 21"*48"; deposited tin 16"*21"; deposited silver 16"*18"; OSP 24"*40";
Processing Size (MIN) Leaded tin 5"*6"; lead-free tin 10"*10"; gold finger 12"*16"; hard gold 3"*3"; copper-nickel gold 8"*10"; sunken tin 2"*4"; sunken silver 2"*4"; OSP 2"*2";
Processing plate thickness Leaded tin spray 0.6-4.0mm; lead-free tin spray 0.6-4.0mm; gold finger plating 1.0-3.2mm; hard gold plating 0.1-5.0mm; chemical gold plating 0.2-7.0mm; graphical copper-nickel gold plating 0.15-5.0mm; submerged tin 0.4-5.0mm; submerged silver 0.4-5.0mm; OSP 0.2-6.0mm;
Golden finger height max 1.5inch
Minimum spacing between gold fingers 6mil
Minimum Segment Spacing Between Segmented Gold Fingers 7.5mil
Surface plating (overlay) thickness Tin spraying 2-40um (0.4um for large tin surface with leaded spray tin, 1.5um for large tin surface with lead-free spray tin)
OSP Film thickness: 0.2-0.6um
Chemically immersed nickel gold Gold thickness 0.05-0.10um, nickel thickness 3-8um
Chemical silver deposition Silver thickness 0.2-0.4um
Chemically immersed tin Tin thickness ≥1.0
Hard gold plating Gold thickness 0.10-1.5um (dry film patterning process), gold thickness 0.10-4.0um (non-dry film patterning process)
Soft gold plating Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non-dry film plating process)
Chemical nickel-palladium gold Gold 0.05-0.10um thick, nickel 3-8um thick, palladium 0.05-0.15um thick
Plating copper-nickel-gold Gold thickness 0.025-0.10um, nickel thickness ≥3um, base copper thickness max 1OZ
Gold finger nickel gold plating Gold thickness 0.25-1.5um (required value refers to the thinnest point), nickel thickness ≥3um
Carbon oil 0.1-0.35mm
Green oil Copper surface cover oil (10-18um), over-hole cover oil (5-8um), line corners ≥5um (once printed, copper thickness below 48um)
Blue glue 0.20-0.80mm
Drilling 0.1/0.15/0.2mm maximum plate thickness for mechanical drilling 0.8mm/1.5mm/2.5mm
Laser drilled holes min 0.1mm
Laser drilled hole diameter max 0.15mm
Machine hole diameter (finished) 0.15-6.2mm (corresponds to drill cutter 0.2-6.3mm)
Minimum finished hole diameter of PTFE material (including mixed pressure) plate 0.25mm (corresponds to drilling tool 0.35mm)
Mechanically buried blind hole aperture ≤ 0.3mm (corresponds to drill cutter 0.4mm)
Drilling diameter of green oil plug hole in disk ≤ 0.45mm (corresponding to drilling tool 0.55mm)
Continuous hole bore diameter minimum 0.35mm (corresponding to drill cutter 0.45mm)
Metallized half-hole bore diameter 0.30mm minimum (corresponds to 0.4mm for drill cutter)
Through-hole plate thickness to diameter ratio max 20:1 (excluding ≤0.2mm cutter diameter; >12:1 to be evaluated)
Laser drilling depth to bore ratio max 1：1
Mechanically controlled deep drilling blind hole depth hole diameter ratio max 1.3:1 (hole diameter ≤ 0.20mm),1.15:1 (hole diameter ≥ 0.25mm)
Mechanically controlled deep drilling (back drilling) depth minimum 0.2mm
Drilling-Minimum distance from mechanical drill hole to conductor (non-buried blind plate and first order laser blind hole) 5.5 mil (≤8 layers); 6.5 mil (10-14); 7 mil (>14 layers)
Drilling - minimum distance from mechanical drill hole to conductor (mechanical buried blind hole plate and second order laser buried blind hole) 7 mil (primary press fit); 8 mil (secondary press fit); 9 mil (tertiary press fit)
Drilling - minimum distance from mechanical drilling to conductor (blind laser buried holes) 7mil（1+N+1）；8mil（1+1+N+1+1或2+N+2）
Drilling - laser drilling to conductor minimum body distance (1st and 2nd order HDI boards) 5mil
Drilling-minimum distance between different network hole walls (after compensation) 10mil
Drilling - minimum distance between hole walls of the same network (after compensation) 6 mil (through hole; laser blind hole); 10 mil (mechanical blind buried hole)
Minimum distance between drill hole-non-metallic hole walls (after compensation) 8mil
Drill hole-hole tolerance (compared to CAD data) ±2mil
Drill-NPTH hole bore tolerance min ±2mil
Drill-NPTH Hole Hole Diameter Accuracy ±2mil
Drill-Tapered Hole Depth Tolerance ±0.15mm
Drill-Tapered Hole Diameter Tolerance ±0.15mm
Pads (rings) Laser hole inner and outer pad size minimum 10 mil (4 mil laser hole), 11 mil (5 mil laser hole)
Minimal size of inner and outer pads for mechanical vias 16 mil (8 mil hole size)
BGA pad diameter minimum 10mil for leaded solder spray process, 12mil for lead-free solder spray process, 7mil for other processes
Pad Tolerance (BGA) +/-1.2mil (pads <12mil); +/-10% (pads ≥12mil)
Wire width/spacing inner layer 1/2OZ：3/3mil
1OZ: 3/4mil
2OZ: 4/5mil
3OZ: 5/8mil
4OZ: 6/11mil
5OZ: 7/13.5mil
6OZ: 8/15mil
7OZ: 9/18mil
8OZ: 10/21mil
9OZ: 11/24mil
10OZ: 12/27mil
Outer layer 1/3OZ-based copper: 3/3 mil
1/2OZ-based copper: 3.5/3.5 mil
1OZ-based copper: 4.5/5 mil
1.43OZ-based copper (positive):4.5/6
1.43OZ-based copper (negative):5/7
2OZ-based copper: 6/7 mil
3OZ-based copper: 6/10 mil
4OZ-based copper: 7.5/13mil
5OZ-based copper: 9/16mil
6OZ-based copper: 10/19mil
7OZ-based copper: 11/22mil
8OZ-based copper: 12/26mil
9OZ-based copper: 13/30mil
10OZ-based copper: 14/35mil
Line Width Tolerance ≤10mil：+/-1.0mil
＞10mil：+/-1.5mil
Solder resist character Maximum hole diameter for solder resist plug holes (both sides covered with oil) 0.9mm
Solder resist ink color Green, yellow, black, blue, red, white, purple, green matte
Character Ink Colors white, yellow, black
Maximum diameter of blue rubber aluminum plug hole 5mm
Resin plug hole drilling hole diameter range 0.1-1.0mm
Maximum thickness to diameter ratio of resin plug hole 10：1
Solder resist character - minimum width of solder resist bridge Base copper ≤ 0.5 OZ, surface treatment with sunken tin: 7.5 (black), 5.5 (other colors), 8.0 (solder resist bridge on large copper surface)
Base copper ≤ 0.5 OZ, other surface finishes other than sunken tin: 5.5 (black, limit 5), 4 (other colors, limit 3.5), 8.0 (large copper surface solder resist bridge)
Base copper 1OZ: 4 (green), 5 (other colors), 5.5 (black, limit 5), 8.0 (solder resist bridge on large copper surface)
Base copper 1.43oz: 4 (green), 5.5 (other colors), 6 (black), 8.0 (solder resist bridge on large copper surface)
Base Copper 2-4OZ: 6, 8 (solder resist bridge on large copper surface)
Profile Distance from the centerline of the V-CUT without copper leakage to the graph H≤1.0mm: 0.3mm (20° refers to V-CUT angle), 0.33mm (30°), 0.37mm (45°);
1.0 < H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
1.6 < H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
V-CUT symmetry tolerance ±4mil
Maximum number of V-CUT lines 100 articles
V-CUT angular tolerance ±5 degrees
Chemical nickel V-CUT angle specification palladium 20、30、45degrees
Golden finger chamfer angle 20、30、45、60degrees
Golden finger chamfering angle tolerance ±5 degrees
>Minimum distance of TAB without chamfering next to the gold finger 6mm
Minimum distance between the side of the gold finger and the edge line of the form 8mil
Controlled depth milling groove (edge) depth accuracy (NPTH) ±0.10mm
Outline dimensional accuracy (edge-to-edge) ±4mil
Minimum tolerance (PTH) for milled slot slot hole ±0.13mm in both slot width and slot length direction
Minimum tolerance (NPTH) for milling slotted holes ±0.10mm in both slot width and slot length direction
Minimum tolerance for drilling slotted holes (PTH) Slot width direction ±0.075mm; Slot length/slot width <2:Slot length direction +/-0.1mm; Slot length/slot width ≥2:Slot length direction +/-0.075m
Minimum tolerance for drilling slotted holes (NPTH) ±0.075mm in slot width direction; slot length/slot width <2:slot length direction +/-0.1mm; slot length/slot width ≥2:slot length direction +/-0.075m
Partial mixing pressure Minimum distance from drill hole to conductor in area of partial mixing pressure 12 (local 10) mil
Minimum distance from the junction of the local mixing pressure to the drill hole 10mil
Metal substrate Number of layers Aluminum substrate, copper substrate: 1-8 layers;
Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) MAX:610*610mm、MIN:5*5mm
Production size maximum (ceramic plate) 100*100mm
Finished plate thickness 0.5-5.0mm
Copper thickness 0.5-10 OZ
Metal base thickness 0.5-4.5mm
Metal base material AL: 1100/1050/2124/5052/6061; Copper: Purple copper pure iron
Minimum finished bore diameter and tolerance NPTH: 0.5±0.05mm; PTH (aluminum substrate, copper substrate): 1.0±0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2±0.10mm;
Profile machining accuracy ±0.03mm
PCB part surface treatment process Leaded/lead-free tin spraying; OSP; sunken nickel (palladium) gold; electric (nickel) soft/hard gold; electroplated tin; nickel-free electroplated soft/hard gold; thick gold fabrication
Metal surface treatment Copper: nickel gold plating; aluminum: anodizing, hard oxidizing, chemical passivation; mechanical treatment: dry sandblasting, brushing
Metal base material All-Power Aluminum Substrate (T-110, T-111); Tengai Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Beggs Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F);
Thickness of thermally conductive adhesive (dielectric layer) 75-150um
Buried copper block size 3*3mm—70*80mm
Buried copper block flatness (drop accuracy) ±40um
Buried copper block to hole wall distance ≥12mil
Thermal conductivity 0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic plate);
Other Finished copper thickness max 12 inner layer: 10 OZ; outer layer: 11 OZ
Finished copper thickness of outer layer 12, 18um base copper: ≥35.8 (reference: 35.8-42.5); ≥40.4 (reference: 40.4-48.5)
35, 50, 70um base copper: ≥55.9; ≥70; ≥86.7
105, 140um base copper: ≥117.6; ≥148.5
Circuit Board Layer Count 1-40 layers
Finished board thickness 0.20-7.0mm (without solder resist); 0.40-7.0mm (with solder resist);
Plate thickness tolerance (conventional) Plate thickness ±10% (>1.0mm); ±0.1mm (≤1.0mm);
Plate thickness tolerance (special) Plate thickness ±0.1mm (≤2.0mm); ±0.15mm (2.1-3.0mm)
Finished size min 10*10mm (without internal positioning splice design; up to 50*50 splice)
Maximum finished size 23*35inch (double-sided); 22.5*33.5inch (four-ply); 22.5*30 (≥six-ply);
Ionic contamination ≤1ug/cm2
Warp Limit Capability 0.1% (This capability requires consistent stacked sheet type, strict symmetry in the stack, a residual copper rate difference of 10% or less in the symmetrical layer, uniform wiring, no concentrated large copper skins or substrates, no glossy or veneer panels in the stack, and a sputter size of ≤ 21 inches on the long side;)<
Impedance tolerance ±5Ω( <50Ω),±10%(≥50Ω)；
plating fill laser blind hole aperture 4-5 mil (4 mil preferred)
Plating filler blind hole with maximum hole depth to hole diameter ratio 1:1 (depth is the thickness of contained copper)