process capability

PCB Capability Technology rigid plate process capability parameter table
Item NameTechnical Capability Parameter
Material TypeOrdinary Tg FR4Biofine S1141&KB (not recommended for lead-free soldering process)
Ordinary Tg FR4 (halogen free)Sheng Yi S1155
High Tg FR4 (halogen free)Bio-gain S1155
Material type used for HDI boardLDPP (IT-180A 1037 and 1086), normal 106 and 1080
High CTIBio-gain S1600
High Tg FR4Isola: FR408, FR408HR, IS410, PCL-370HR; Lian Mao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic:R-5775K (Megtron6) R- 5725 (Megtron4) Taiyao:TU-768, TU-662; Tengfei:VT-47.
Ceramic powder filled high frequency materialsRogers:Rogers4350、Rogers4003
Material mixing and pressingRogers, Nelco and FR-4
Product TypeRigid boardsBackplane, HDI, Multilayer Buried Blind Hole, Buried Capacitor, Buried Resistor, Thick Copper, Power Thick Copper, Semiconductor Test Board
Stacking methodMultiple press-fit blind buried hole boardSame side press-fit ≤3
HDI board type1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated to fill holes
Surface treatmentSurface treatment type (lead-free)Electroplated cupro-nickel gold, submerged gold, hard gold plating (with/without nickel), gold finger plating, lead-free tin spraying, OSP, chemical nickel-palladium gold, soft gold plating (with/without nickel), submerged silver, submerged tin, ENIG+OSP, ENIG+G/F, full plate gold plating+G/F, submerged silver+G/F, submerged tin+G/F
Surface treatment type (leaded)Tin spray with lead
Thickness to diameter ratio10 1 (leaded/leadless sprayed tin chemically immersed nickel gold immersed silver immersed tin chemically immersed nickel palladium gold) 8 1 (OSP)
Processed Size (MAX)Leaded sprayed tin
Surface treatment type (with lead)Leaded tin spray 22"*39"; lead-free tin spray 22"*24"; gold finger plated 24"*24"; hard gold plated 24"*28"; chemically deposited gold 21"*27"; graphically plated copper-nickel-gold 21"*48"; deposited tin 16"*21"; deposited silver 16"*18"; OSP 24"*40";
Processing Size (MIN)Leaded tin 5"*6"; lead-free tin 10"*10"; gold finger 12"*16"; hard gold 3"*3"; copper-nickel gold 8"*10"; sunken tin 2"*4"; sunken silver 2"*4"; OSP 2"*2";
Processing plate thicknessLeaded tin spray 0.6-4.0mm; lead-free tin spray 0.6-4.0mm; gold finger plating 1.0-3.2mm; hard gold plating 0.1-5.0mm; chemical gold plating 0.2-7.0mm; graphical copper-nickel gold plating 0.15-5.0mm; submerged tin 0.4-5.0mm; submerged silver 0.4-5.0mm; OSP 0.2-6.0mm;
Golden finger height max1.5inch
Minimum spacing between gold fingers6mil
Minimum Segment Spacing Between Segmented Gold Fingers7.5mil
Surface plating (overlay) thicknessTin spraying2-40um (0.4um for large tin surface with leaded spray tin, 1.5um for large tin surface with lead-free spray tin)
OSPFilm thickness: 0.2-0.6um
Chemically immersed nickel goldGold thickness 0.05-0.10um, nickel thickness 3-8um
Chemical silver depositionSilver thickness 0.2-0.4um
Chemically immersed tinTin thickness ≥1.0
Hard gold platingGold thickness 0.10-1.5um (dry film patterning process), gold thickness 0.10-4.0um (non-dry film patterning process)
Soft gold platingGold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non-dry film plating process)
Chemical nickel-palladium goldGold 0.05-0.10um thick, nickel 3-8um thick, palladium 0.05-0.15um thick
Plating copper-nickel-goldGold thickness 0.025-0.10um, nickel thickness ≥3um, base copper thickness max 1OZ
Gold finger nickel gold platingGold thickness 0.25-1.5um (required value refers to the thinnest point), nickel thickness ≥3um
Carbon oil0.1-0.35mm
Green oilCopper surface cover oil (10-18um), over-hole cover oil (5-8um), line corners ≥5um (once printed, copper thickness below 48um)
Blue glue0.20-0.80mm
Drilling0.1/0.15/0.2mm maximum plate thickness for mechanical drilling0.8mm/1.5mm/2.5mm
Laser drilled holes min0.1mm
Laser drilled hole diameter max0.15mm
Machine hole diameter (finished)0.15-6.2mm (corresponds to drill cutter 0.2-6.3mm)
Minimum finished hole diameter of PTFE material (including mixed pressure) plate 0.25mm (corresponds to drilling tool 0.35mm)
Mechanically buried blind hole aperture ≤ 0.3mm (corresponds to drill cutter 0.4mm)
Drilling diameter of green oil plug hole in disk ≤ 0.45mm (corresponding to drilling tool 0.55mm)
Continuous hole bore diameter minimum 0.35mm (corresponding to drill cutter 0.45mm)
Metallized half-hole bore diameter 0.30mm minimum (corresponds to 0.4mm for drill cutter)
Through-hole plate thickness to diameter ratio max20:1 (excluding ≤0.2mm cutter diameter; >12:1 to be evaluated)
Laser drilling depth to bore ratio max1:1
Mechanically controlled deep drilling blind hole depth hole diameter ratio max 1.3:1 (hole diameter ≤ 0.20mm),1.15:1 (hole diameter ≥ 0.25mm)
Mechanically controlled deep drilling (back drilling) depth minimum0.2mm
Drilling-Minimum distance from mechanical drill hole to conductor (non-buried blind plate and first order laser blind hole)5.5 mil (≤8 layers); 6.5 mil (10-14); 7 mil (>14 layers)
Drilling - minimum distance from mechanical drill hole to conductor (mechanical buried blind hole plate and second order laser buried blind hole)7 mil (primary press fit); 8 mil (secondary press fit); 9 mil (tertiary press fit)
Drilling - minimum distance from mechanical drilling to conductor (blind laser buried holes)7mil(1+N+1);8mil(1+1+N+1+1或2+N+2)
Drilling - laser drilling to conductor minimum body distance (1st and 2nd order HDI boards)5mil
Drilling-minimum distance between different network hole walls (after compensation)10mil
Drilling - minimum distance between hole walls of the same network (after compensation)6 mil (through hole; laser blind hole); 10 mil (mechanical blind buried hole)
Minimum distance between drill hole-non-metallic hole walls (after compensation)8mil
Drill hole-hole tolerance (compared to CAD data)±2mil
Drill-NPTH hole bore tolerance min±2mil
Drill-NPTH Hole Hole Diameter Accuracy±2mil
Drill-Tapered Hole Depth Tolerance±0.15mm
Drill-Tapered Hole Diameter Tolerance±0.15mm
Pads (rings)Laser hole inner and outer pad size minimum 10 mil (4 mil laser hole), 11 mil (5 mil laser hole)
Minimal size of inner and outer pads for mechanical vias16 mil (8 mil hole size)
BGA pad diameter minimum10mil for leaded solder spray process, 12mil for lead-free solder spray process, 7mil for other processes
Pad Tolerance (BGA) +/-1.2mil (pads <12mil); +/-10% (pads ≥12mil)
Wire width/spacinginner layer1/2OZ:3/3mil
1OZ: 3/4mil
2OZ: 4/5mil
3OZ: 5/8mil
4OZ: 6/11mil
5OZ: 7/13.5mil
6OZ: 8/15mil
7OZ: 9/18mil
8OZ: 10/21mil
9OZ: 11/24mil
10OZ: 12/27mil
Outer layer1/3OZ-based copper: 3/3 mil
1/2OZ-based copper: 3.5/3.5 mil
1OZ-based copper: 4.5/5 mil
1.43OZ-based copper (positive):4.5/6
1.43OZ-based copper (negative):5/7
2OZ-based copper: 6/7 mil
3OZ-based copper: 6/10 mil
4OZ-based copper: 7.5/13mil
5OZ-based copper: 9/16mil
6OZ-based copper: 10/19mil
7OZ-based copper: 11/22mil
8OZ-based copper: 12/26mil
9OZ-based copper: 13/30mil
10OZ-based copper: 14/35mil
Line Width Tolerance≤10mil:+/-1.0mil
>10mil:+/-1.5mil
Solder resist characterMaximum hole diameter for solder resist plug holes (both sides covered with oil)0.9mm
Solder resist ink colorGreen, yellow, black, blue, red, white, purple, green matte
Character Ink Colorswhite, yellow, black
Maximum diameter of blue rubber aluminum plug hole5mm
Resin plug hole drilling hole diameter range0.1-1.0mm
Maximum thickness to diameter ratio of resin plug hole10:1
Solder resist character - minimum width of solder resist bridgeBase copper ≤ 0.5 OZ, surface treatment with sunken tin: 7.5 (black), 5.5 (other colors), 8.0 (solder resist bridge on large copper surface)
Base copper ≤ 0.5 OZ, other surface finishes other than sunken tin: 5.5 (black, limit 5), 4 (other colors, limit 3.5), 8.0 (large copper surface solder resist bridge)
Base copper 1OZ: 4 (green), 5 (other colors), 5.5 (black, limit 5), 8.0 (solder resist bridge on large copper surface)
Base copper 1.43oz: 4 (green), 5.5 (other colors), 6 (black), 8.0 (solder resist bridge on large copper surface)
Base Copper 2-4OZ: 6, 8 (solder resist bridge on large copper surface)
ProfileDistance from the centerline of the V-CUT without copper leakage to the graphH≤1.0mm: 0.3mm (20° refers to V-CUT angle), 0.33mm (30°), 0.37mm (45°);
1.0 < H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
1.6 < H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
V-CUT symmetry tolerance±4mil
Maximum number of V-CUT lines100 articles
V-CUT angular tolerance±5 degrees
Chemical nickel V-CUT angle specification palladium20、30、45degrees
Golden finger chamfer angle20、30、45、60degrees
Golden finger chamfering angle tolerance±5 degrees
>Minimum distance of TAB without chamfering next to the gold finger6mm
Minimum distance between the side of the gold finger and the edge line of the form 8mil
Controlled depth milling groove (edge) depth accuracy (NPTH)±0.10mm
Outline dimensional accuracy (edge-to-edge)±4mil
Minimum tolerance (PTH) for milled slot slot hole±0.13mm in both slot width and slot length direction
Minimum tolerance (NPTH) for milling slotted holes±0.10mm in both slot width and slot length direction
Minimum tolerance for drilling slotted holes (PTH)Slot width direction ±0.075mm; Slot length/slot width <2:Slot length direction +/-0.1mm; Slot length/slot width ≥2:Slot length direction +/-0.075m
Minimum tolerance for drilling slotted holes (NPTH)±0.075mm in slot width direction; slot length/slot width <2:slot length direction +/-0.1mm; slot length/slot width ≥2:slot length direction +/-0.075m
Partial mixing pressureMinimum distance from drill hole to conductor in area of partial mixing pressure12 (local 10) mil
Minimum distance from the junction of the local mixing pressure to the drill hole10mil
Metal substrateNumber of layersAluminum substrate, copper substrate: 1-8 layers;
Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate)MAX:610*610mm、MIN:5*5mm
Production size maximum (ceramic plate)100*100mm
Finished plate thickness0.5-5.0mm
Copper thickness0.5-10 OZ
Metal base thickness0.5-4.5mm
Metal base materialAL: 1100/1050/2124/5052/6061; Copper: Purple copper pure iron
Minimum finished bore diameter and toleranceNPTH: 0.5±0.05mm; PTH (aluminum substrate, copper substrate): 1.0±0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2±0.10mm;
Profile machining accuracy±0.03mm
PCB part surface treatment processLeaded/lead-free tin spraying; OSP; sunken nickel (palladium) gold; electric (nickel) soft/hard gold; electroplated tin; nickel-free electroplated soft/hard gold; thick gold fabrication
Metal surface treatmentCopper: nickel gold plating; aluminum: anodizing, hard oxidizing, chemical passivation; mechanical treatment: dry sandblasting, brushing
Metal base materialAll-Power Aluminum Substrate (T-110, T-111); Tengai Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Beggs Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F);
Thickness of thermally conductive adhesive (dielectric layer)75-150um
Buried copper block size3*3mm—70*80mm
Buried copper block flatness (drop accuracy)±40um
Buried copper block to hole wall distance≥12mil
Thermal conductivity0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic plate);
OtherFinished copper thickness max12 inner layer: 10 OZ; outer layer: 11 OZ
Finished copper thickness of outer layer12, 18um base copper: ≥35.8 (reference: 35.8-42.5); ≥40.4 (reference: 40.4-48.5)
35, 50, 70um base copper: ≥55.9; ≥70; ≥86.7
105, 140um base copper: ≥117.6; ≥148.5
Circuit Board Layer Count1-40 layers
Finished board thickness0.20-7.0mm (without solder resist); 0.40-7.0mm (with solder resist);
Plate thickness tolerance (conventional)Plate thickness ±10% (>1.0mm); ±0.1mm (≤1.0mm);
Plate thickness tolerance (special)Plate thickness ±0.1mm (≤2.0mm); ±0.15mm (2.1-3.0mm)
Finished size min10*10mm (without internal positioning splice design; up to 50*50 splice)
Maximum finished size23*35inch (double-sided); 22.5*33.5inch (four-ply); 22.5*30 (≥six-ply);
Ionic contamination≤1ug/cm2
Warp Limit Capability0.1% (This capability requires consistent stacked sheet type, strict symmetry in the stack, a residual copper rate difference of 10% or less in the symmetrical layer, uniform wiring, no concentrated large copper skins or substrates, no glossy or veneer panels in the stack, and a sputter size of ≤ 21 inches on the long side;)<
Impedance tolerance±5Ω( <50Ω),±10%(≥50Ω);
plating fill laser blind hole aperture4-5 mil (4 mil preferred)
Plating filler blind hole with maximum hole depth to hole diameter ratio1:1 (depth is the thickness of contained copper)