Fast Turn PCB has HDI team to focus on HDI projects, we have laser drill machines, copper plating lines in house to reduce leadtime and support good quality. so our best HDI board can be 5-7 days delivery. We never receive complaints about quality issues for our HDI board.


What is a HDI PCB?

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.

Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.

HDI PCB Advantage

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Function improved by HDI PCB:

1.Denser trace routing
2.More stable power
3.Reduce interference inductance and capacitance effects
4.Improve signal integrity in high-speed design
Accelerate Development with HDI Printed Circuit Boards
1.Easier to place SMD components
2.Faster routing
3.Reduce frequent relocation of components
4.More component space (also by Via-in-Pad)

Check FastTurn HDI PCB manufacturing capabilities in the following table:

HDI Strcuctures Type of

Micro vias





Prototype Available
1+N+1 Blind vias Yes Yes Yes 4 layers+
2+N+2 Blind/Buried staggered vias Yes Yes Yes 6 layers+
2+N+2 Blind/Buried stacked vias Yes Yes Yes 6 layers+
3+N+3 Blind/Buried staggered vias Yes Yes Yes 8 layers+
3+N+3 Blind/Buried stacked vias Yes Yes Yes 8 layers+
5+N+5 Blind/Buried stacked vias Yes Yes Yes 12 layers+

Check our HDI PCB capabilities by reviewing the table found below:

Feature Capability
Quality Grade Standard IPC 2
Number of Layers 4-24 layers
Order Quantity 1 pcs- 10000+pcs
Build days 2 days- 5 weeks
Material FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board Size Min 6*6mm | Max 457*610mm
Board Thickness 0.4mm – 3.0mm
Copper Weight (Finished) 0.5oz – 2.0oz
Min Tracing/Spacing 2.5mil/2.5mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the Gerber file
Silkscreen Color White, Black, Yellow
Surface Finish HASL – Hot Air Solder Leveling

Lead Free HASL – RoHS

ENIG – Electroless Nickle/Immersion Gold – RoHS

Immersion Silver – RoHS

Immersion Tin – RoHS

OSP – Organic Solderability Preservatives – RoHS

Min Annular Ring 4mil, 3mil – laser drill
Min Drilling Hole Diameter 6mil, 4mil – laser drill
Max Exponents of Blind/Buried Vias stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Other Techniques Flex-rigid combination

Via In Pad

Buried Capacitor (only for Prototype PCB total area ≤1m²)

HDI PCB Samples show >>

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