Fast Turn PCB INT'L Company Limited.

PCB layout design service

Capability

New Products

As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance. Manufactured with high reliability, our flex circuits are built to withstand the rigors of aerospace, medical, and military applications. 

Fast Turn is not only good at making regular single or 2 layers FPC, but also multilayer FPC. So far we could make FPC up to 14 Layer. We are so proud to solve your problem with the design challenges such as: unavoidable crossovers, specific impedance requirements, elimination of crosstalk, additional shielding and high component density.


Below are the detailed capabilities:

 Flex PCB Capability 

Items

Type

 Normal Manufacturing Capability

Material

DuPont

AL9111R, AP9121R, AP9131R, AP8525R

Panasonic

R-F775   11RB-M, R-F775   22RB-M, R-F775   21RB-M

Taiflex

NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520JY

Min.width/space of outer layer

1/2 oz finished copper

3.0/3.0mil

1 oz finished copper

3.5/3.5mil

2 oz finished copper

5/5mil

Min trace width/space wtidth of out layer (2OZ finishedcopper,Flex layer on top or bottom)

1/3 oz

5/5mil

1/2 oz

5/5mil

1 oz

6.5/5mil

2 oz

8/5.5mil

Min.width/space of inner layer

1/2 oz finished copper

3.5/3.5mil

1 oz finished copper

4/4mil

Board Spec.

Layers

0-14

Thickness

0.07-4.0mm

Max dimension

10X18 Inch

Min precision Of Dim

±4mil

Min diameter of holes

4mil (Laser drill); 8mil(mechanical drill)

Aspect ratio

10:1

Min trace width/space wtidth of gridding circr

5/5mil

Min distance Between drilling&conductor(via holes)

2 layers

7mil

3~6 layers

9mil

≥7layers

11mil

Min distance Between drilling&conductor(component holes)

2 layers

10mil

3~6 layers

12mil

≥7layers

14mil

Min distance Between drilling&conductor

buried &blind holes

7mil

Min ring of inner layer (via holes)

≤6 Layers

5mil 

>8Layers

8mil

Min ring of inner layer (component holes)

≤6 Layers

8mil

>8Layers

11mil

HDI board

process capability

1+n+1

Surface treatment

Plating Gold(Hard gold)

Normal:0.25-0.76um;Hard gold:0.76-2um;

ENIG

Ni:3--8um,Au:0.05-0.1um

Immersion Tin

0.80-1.20um

Immersion Silver

0.10-0.30um

0SP

0.15-0.30um

HASL

2-40um

HASL lead free

2-40um

Silver ink

10-25um

Selective surface finishing

ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.

Min. bended radius

single side flex

3-6 times the flex thickness

double sides flex

6-10 times the flex thickness

multi-layers flex

10-15 times the flex thickness

dynamic bending

20-40 times the flex thickness




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