Industry-news

I. PCB surface treatment Antioxidation, tin spray, lead-free tin spray, sink gold, sink tin, sink silver, hard gold plating, full board gold plating, gold finger, nickel palladium gold OSP: lower cost, good solderability, harsh storage conditions, short time, environmentally friendly process, good solder, flat. Spray tin: Spray tin boards are generally multi-layer (4-46 layers) high …

Brief analysis of PCB board surface treatment process Read More »

Hot air leveling is to dip the printed wiring board into molten solder (63SN/37PB) and then use hot air to blow off the excess solder on the surface of the printed wiring board and in the metallization holes to get a smooth, even and shiny solder coating layer. After the hot air leveling of the …

Hot air leveling process copper exposure analysis Read More »

PCB heat sink, for electronic devices, generates a certain amount of heat when working, thus causing the internal temperature of the device to rise rapidly, if this heat is not distributed in a timely manner, the device will continue to heat up, the device will fail due to overheating, and the reliability of the electronic …

10 simple and effective PCB cooling methods Read More »

First: tell the difference between a good and a bad board by its appearance In general, the appearance of FPC circuit boards can be analyzed and judged by three aspects; 1. Standard rules for size and thickness. The thickness of the circuit board is different sizes for standard PCBs, so customers can measure and check …

How to judge the good and bad of FPC circuit board? Read More »

In general there are two main rules to follow for stacked design: 1. Each alignment layer must have an adjacent reference layer (power or ground); 2. The adjacent main power and ground layers are to be kept at a minimum distance to provide a large coupling capacitance. Here is an example of a stack from …

A text to read the PCB stack design Read More »

In the usual PCB design, we will encounter various safety clearance issues, such as vias and pads The spacing, the spacing between traces and traces, etc. are all things we should consider. So today we divide these spacing requirements into two categories, one is: electrical safety spacing; the other is: non-electrical safety spacing. 1. The …

When designing PCB, these spacing requirements must be paid attention to Read More »

With the increase in the quality of electronic assembly technology and the competitive needs of the market, fully automatic inserters are rapidly gaining popularity. This has led to increasing demands on the quality of punching of single-sided PCB paper-based boards (a few single- and double-sided non-metallized hole epoxy-glass cloth substrates also use punching). This article …

PCB punching 10 common mistakes and solutions Read More »

Smart manufacturing is to realize the intelligence and innovation of the whole manufacturing value chain, and is a further enhancement of the deep integration of informationization and industrialization. At present, the “intelligence” of smart manufacturing is still at the level of Smart. The smart manufacturing system has the ability of data collection, data processing and …

In-depth interpretation of the ten directions of PCB intelligent manufacturing Read More »