High density interconnect pcb

10 layer two stacked HDI three times laminations with selective hard gold  fine circuit PCB Board Manufacturer

High density interconnect pcb Specifications:

Layer:  10-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L3-8;L8-9;L9-10 )
Material: FR4 TG170 Thickness: 1.6mm±10%
Copper thickness: 18/35μm Surface finish: Slective 30μ” Hard Gold + ENIG
Track Width&Gap 3/3mil Soldermask/Legend Green/White
IPC Standard: IPC3 Unit size: 86x43mm
Array size: 86x43mm(1-up) Minimum hole copper: 25μm

Product detail:

* For the 10 layer complex Blind& Buried Micro-Vias rigid PCB boards with Micro-Vias in L1-L2 、 L2-L3、L3-L8、L8-L9、L9-L10, we choose HI TG FR4  in the rigid board to ensure the lamination process. In this way, the stability of quality is easily guaranteed.

*  Also we have the Min copper 25μm in holes as our standard.

Get Quotation:sales@fastturnpcbs.com

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