Via Filling

Via Filling Impedance Control Circuit Board

6 layer via filled impedance control circuit board

Via Filling PCB specification:

Layer: 6 layers Material: FR4 TG170
Impedance control: Yes Thickness: 1mm
Min line width & space: 4/4mil Copper thickness: 0.5/1.0 OZ
Surface finish: ENIG Leading time: 7 working days

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