Technology Roadmap

201820192020
Minimum line width/spacingMass ProductionPrototypeMass ProductionPrototypeMass ProductionPrototype
Maximum number of floors243026342636
Minimum board thickness0.30.20.30.20.30.2
Minimum copper cladding thickness0.050.050.050.050.050.05
Minimum laser hole0.10.10.10.10.10.1
Maximum board thickness to hole ratio16:01:0018:01:0018:01:0020:01:0020:01:0022:01:00
Minimum over-hole0.150.10.150.10.10.1
Impedance Control±7±7±7±5±7±5
RoHs CertificationHaveHaveHaveHaveHaveHave
Lead-free processHaveHaveHaveHaveHaveHave
Green MaterialsHaveHaveHaveHaveHaveHave
Copper-filled microporousHaveHaveHaveHaveHaveHave
HDI Structure1+N+12+N+22+N+23+N+32+N+24+N+4
ELIC grade10 layer12 layer12 layer14 layer14 layer14 layer
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