HDI circuit boards: microvias, stack-ups, and via-in-pad explained — learn how to pick the right HDI PCB manufacturer for prototyping and mass production.
Learn how resin content impacts PCB reliability, Z-axis expansion, and CAF risk, and why flatness and symmetrical stackups are essential to prevent warpage and production jams.
Learn how to choose PCB dielectric stackup—single vs. multi prepreg—using pressed thickness, resin content, and glass style to control impedance, cost, and manufacturability.
Add QR Code PCB to your production with practical tips on laser marking, silkscreen, size, placement, and traceability to ensure reliable scanning and serial tracking.
Create a production-ready pcb schematic — from symbols and netlists to Gerber export and PCBA handoff. Follow a clear step-by-step checklist and grab downloadable templates.
PCB Trace Guide: Learn how to size trace width for current and temperature, control impedance for high-speed signals, and validate designs with trace width calculators.
Surface mount PCB guide: design tips, stencil & solder paste advice, reflow best practices, inspection and troubleshooting to move prototypes into production.
Learn how copper foil roughness drives GHz signal loss in high-speed PCBs. Clear skin-effect primer, Df test highlights, and practical fixes—use low-profile or RTF foils to cut insertion loss.
