When designing modern electronic products, selecting the right type of PCB—FPC soft board or rigid PCB—is crucial for performance, reliability, and product innovation. In this blog, we’ll focus on the benefits and use cases of FPC flexible PCBs, and offer guidance on how to choose between flexible and rigid options depending on your needs.

Industrial control boards are the core components of automation systems, acting as the "brain" of industrial equipment. Their performance and reliability are critical to overall system stability. The Surface Mount Technology (SMT) process used in manufacturing these boards demands high precision and stringent quality control. This article explores the essential SMT process requirements for industrial control boards across every production stage.

In the world of Printed Circuit Board Assembly (PCBA), the Bill of Materials (BOM) table plays an essential role throughout the manufacturing process. Serving as the backbone of component procurement, production planning, quality control, cost management, and maintenance, a well-structured BOM ensures that everything runs smoothly from start to finish.

When it comes to PCB surface finishes, choosing the right process is critical to ensure performance, reliability, and cost-effectiveness. Among the most widely used surface treatments in PCB manufacturing are Immersion Gold (ENIG) and Hot Air Solder Leveling (HASL), often referred to as tin spraying. While both serve to protect the exposed copper and enhance solderability, they differ significantly in terms of process, performance, cost, and application.

PCB stack design is an important step before circuit board layout design, which involves the arrangement of copper and insulation layers that make up the PCB. Through reasonable stack design, the performance, reliability, and cost of the circuit board can be ensured to achieve the best balance.

PCBA process=SMT processing process+DIP processing process. According to different production technologies, PCBA has various process flows, including single-sided mixed assembly process, single-sided DIP insertion process, single-sided SMT mounting process, single-sided mounting and double-sided mixed assembly process, double-sided SMT mounting process and insertion mixing process, and so on. There are certain process differences in different manufacturing processes. Below is a detailed explanation of each process:

Wave soldering and reflow soldering are two commonly used soldering techniques in the electronic manufacturing industry, which have significant differences in principles, applications, functions, and other aspects.

SMT, with its efficient and high-density characteristics, has become a key technical support for the miniaturization and high performance of modern electronic products. Below, we will analyze the core operating mechanism of SMT from three dimensions: technical principles, core processes, and key links.

PCBA is one of the core components of the electronic manufacturing industry, involving multiple complex process steps and precise technical operations. The production process of PCBA includes project evaluation and PCB board design, component procurement and inspection, solder paste printing and surface mount processing, reflow soldering and plug-in, wave soldering and cleaning, assembly, testing and packaging processes.

The reliability testing of PCB boards is a complex and rigorous process, covering multiple aspects such as soldering quality, functionality, environmental adaptability, and specialized testing. By selecting testing items and standards reasonably and applying and executing them according to the correct process, the quality and performance of PCB boards can be ensured to meet the highest standards.

ISO 13485 certification, as a quality management system standard in the medical device industry, has the purpose of ensuring compliance of medical devices, improving product quality and safety, enhancing customer trust and satisfaction, optimizing processes and resource management, etc.

In the electronic assembly industry, SMT and DIP are two important electronic component installation methods, each with unique characteristics and application scenarios. When choosing which technology to use, it is necessary to comprehensively consider factors such as specific application requirements, production costs, and production efficiency.