Flex PCB Manufacturer

Rapid Prototype & Volume Flex PCB Fabrication Services

As a leading China flex PCB supplier, we specialize in high-quality flex circuit manufacturing—from rapid-turn prototyping to full-volume flexible PCB fabrication. Upload your Gerber files now for a fast, reliable quote.

What is Flex PCB Manufacturing?

Flex PCB manufacturing refers to the process of designing and fabricating flexible printed circuit boards (FPCs) — electronic interconnects made from flexible substrates like polyimide or polyester.

Unlike rigid PCBs, Flex PCBs can bend, fold, or twist without breaking, making them ideal for compact, dynamic, or curved electronic applications.

Applications

  • Wearable Devices

  • Automotive Electronics

  • Medical Equipment

  • Aerospace and Military Systems

  • Consumer Electronics (Foldable Phones, Cameras, etc.)

Key Characteristics

  • Flexible Substrate Materials

    Typically polyimide or PET, offering excellent thermal stability and flexibility.

  • Compact Design

    Enables 3D routing, reducing space and weight in electronic devices.

  • Durability

    High resistance to vibration and movement over time, making them suitable for dynamic environments.

  • Customization

    Easily tailored to meet the electrical and mechanical requirements of specific applications.

Manufacturing Process

  • Design & Stack-Up Planning

    Optimizing the circuit layout for bendability, impedance, and signal integrity.

  • Photolithography & Etching

    Creating copper traces on the flexible base material.

  • Lamination & Coverlay Application

    Protecting the circuit with flexible cover films or solder masks.

  • Drilling & Plating

    Forming vias and applying copper through-holes for interlayer connections.

  • Testing & Quality Assurance

    Electrical testing, visual inspection, and reliability checks (IPC standards compliant).

Our Core Advantages

Premium Materials Only

We use high-grade polyimide and RA copper to ensure excellent flexibility, heat resistance, and long-term reliability. All materials meet RoHS and IPC Class 3 standards.

Advanced Fabrication Process

From single-layer to HDI rigid-flex, our manufacturing process ensures tight tolerances, controlled impedance, and high-density trace routing.

Engineering Support Included

Our in-house engineers offer DFM guidance, Gerber reviews, and stack-up optimization — helping you reduce revisions and shorten your time to market.

Certified Quality Control

We follow ISO 9001 and IPC-6013 guidelines with 100% E-testing, AOI, and reliability checks for every production run — prototypes and mass orders alike.

Fast, Flexible Delivery

We support quick-turn prototyping (as fast as 48 hours) and scalable mass production with flexible batch sizes and global logistics.

Trusted Across Industries

Our Flex PCBs are used in medical, automotive, consumer, aerospace, and industrial products — anywhere performance and space savings are critical.

Capabilities

Capability Parameter
PCB Type Flexible PCB
Quality Grade Standard IPC 2
Material PI
PET
Number of Layers 1 Layer
2 Layers
4 Layers
6 Layers
8 Layers
Max PCB Size 1 Layer: 4000mm x 240mm
2 Layers: 800mm x 240mm
Multi-layers: 350mm x 240mm
Board Size Tolerance (Outline) ±0.1mm
Soldering Pad Diameter ≥0.3mm
Quality Grade Standard IPC 2
Lead Time 5-7 Days
Coverlay Yellow, White, Black, None
Coverlay Opening Size ≥0.6mm x 0.6mm
Min Spacing Colverlay to Soldering Pad ≥0.15mm
Soldermask Color Green and Others
Soldermask Bridge Green: ≥0.1mm
Others: ≥0.15mm
Minimum Character Width (Legend) ≥0.7mm
Minimum Character Height (Legend) ≥0.8mm
Min Spacing from Silkscreen to Soldering ≥0.2mm
Surface Finish ENIG
OSP
Immersion Tin
Chemical Silver
Impedance Control Single-ended 50Ω
Differential Pairs100Ω
Tolerance ±10%
Stiffener Material PI
FR-4
Aluminum
Steel
Edge Rail Width ≥10mm

Product Showcase

Design and Manufacturability

Bend Radius Rules

Bend Radius Rules

Maintain a minimum bend radius of 6× board thickness for static applications and 12× or more for dynamic flexing. This prevents copper cracking and mechanical stress.

Trace Routing Tips

Trace Routing Tips

Use smooth, curved traces instead of sharp angles. Avoid routing across bend areas. Stagger traces in multilayer designs to reduce stress concentration.

Layer Stack-Up

Layer Stack-Up

Use symmetrical layer structures. Avoid placing copper on both sides of the flex zone. Stack-ups should support flexibility and signal integrity.

Stiffeners & Support

Stiffeners & Support

Add stiffeners near connectors or SMT areas to prevent mechanical failure. Use FR4, PI, or stainless steel depending on assembly and handling needs.

Via & Pad Placement

Via & Pad Placement

Keep vias and pads out of bend zones. Use teardrop pads and anchor structures to reinforce solder joints and improve durability.

Material Selection

Material Selection

Choose RA copper and polyimide base materials for better flexibility and thermal performance. Adhesiveless laminates reduce thickness and delamination risks.

Manufacturing Process Overview

Step 01
Step 01

Material Preparation & Cutting

The process begins with high-performance flexible base materials, typically polyimide films laminated with copper foil. These sheets are precisely cut to panel size, ready for photolithography and circuit patterning.

Step 02
Step 02

Drilling (Via and Hole Creation)

Next, microvias and through-holes are created to connect different layers or accommodate component pins. This is done using laser drilling for microvias or mechanical drilling for larger holes. Precision and cleanliness are critical to ensure high-quality interconnects.

Proper via wall quality ensures better plating adhesion and long-term reliability.

Step 03
Step 03

Circuit Pattern Imaging

The flexible copper-clad material is coated with photoresist and exposed to UV light through a circuit mask (phototool). This defines the required circuit pattern. The unexposed resist is then removed, revealing the copper to be etched away.

Step 04
Step 04

Copper Etching

In this step, chemical etching removes unwanted copper, leaving only the intended circuitry. High-resolution etching is essential to achieve fine line/space and controlled impedance required in modern flex circuits.

Step 05
Step 05

Layer Lamination (for Multilayer Flex or Rigid-Flex)

For multilayer designs, individual flex layers are aligned and laminated together under controlled temperature and pressure. Adhesive layers and polyimide films are used to form a unified structure. Rigid-flex PCBs include rigid sections laminated into the stack-up during this phase.

Step 06
Step 06

Coverlay Application or Solder Mask

To protect the circuits, a polyimide coverlay or liquid solder mask is applied. Coverlay is more flexible and preferred for dynamic flex applications. Openings are created at pads, vias, or connector areas for soldering or component assembly.

Step 07
Step 07

Surface Finish Application

Surface finishes like ENIG (Electroless Nickel Immersion Gold), OSP, or HASL are applied to exposed copper pads. This step improves solderability, oxidation resistance, and contact performance.

Step 08
Step 08

Component Soldering (Optional for Assembly Services)

If Flex PCB assembly is requested, components are placed and soldered using reflow or hand soldering techniques. SMT-compatible flex PCBs are typically assembled in array panels for ease of handling.

Step 09
Step 09

Electrical Testing & Final Inspection

Every board undergoes electrical continuity and isolation testing to verify open/short circuits. Visual inspections and AOI (Automated Optical Inspection) ensure trace accuracy and pad quality. Additional tests may include X-ray, dimensional checks, and bend-cycle reliability tests.

Step 10
Step 10

Final Cutting, Packaging & Shipping

Finished PCBs are laser-cut or routed into final shape and packaged in ESD-safe materials. Custom labeling, serialization, and documentation are included per customer request.

FAQ

The recommended minimum bend radius depends on whether the flex area is static or dynamic:

  • Static Flexing: Minimum radius = 6× the board thickness
  • Dynamic Flexing: Minimum radius = 12× or more of the board thickness

Using rolled annealed (RA) copper improves bendability and extends flex life.

Flex PCBs are primarily made from polyimide (PI) or polyester (PET) substrates with copper foil layers. We also use adhesiveless laminates for high-reliability applications. Coverlays, stiffeners (FR4 or stainless steel), and surface finishes (ENIG, OSP) are added depending on the design.

Lead times depend on complexity and quantity:

  • Prototype Flex PCBs: 3–7 business days
  • Production Runs: 7–20 business days

Expedited options are available for urgent projects — contact us for a custom quote.

Yes. We offer full Rigid-Flex PCB manufacturing, including HDI and multilayer designs. Our process supports complex 3D assemblies and ensures precise layer registration and bend reliability.

We offer a range of surface finishes to meet different electrical and soldering requirements:

  • ENIG (Electroless Nickel Immersion Gold) – best for fine-pitch and wire bonding
  • OSP (Organic Solderability Preservative) – cost-effective, RoHS compliant
  • Immersion Silver / Tin, Lead-Free HASL, and others available upon request
  • Flex PCBs use flexible base materials and are designed to bend, fold, or twist during use.
  • Rigid PCBs are built on FR4 substrates and are not designed for movement.

Flex PCBs save space, reduce weight, and improve durability in dynamic environments.

Absolutely. Our engineering team offers free DFM reviews, helping you optimize your design for manufacturability, cost efficiency, and long-term reliability. Upload your Gerber files, and we’ll evaluate them before production begins.

Yes. All our Flex PCBs are RoHS-compliant and manufactured to IPC-6013 and IPC-A-600/610 Class 2 or Class 3 standards, depending on application needs. Certifications and test reports are available upon request.

To provide an accurate and fast quote, please include:

  • Gerber files (RS-274X format preferred)
  • Bill of Materials (BOM) if assembly is needed
  • Stack-up or layer information
  • Quantities and delivery timeline
  • Special requirements (e.g., stiffeners, impedance control, finish type)

Put your parts
into production today

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