BGA PCB Assembly Services

Precision BGA Soldering & Assembly for Complex Designs

As a trusted provider of BGA assembly services in China, we specialize in high-precision BGA soldering and assembly for advanced PCB designs. From prototypes to production, upload your Gerbers and BOM now for a quick, accurate quote.

What is BGA Assembly?

BGA Assembly

BGA (Ball Grid Array) assembly is an advanced surface-mount technology widely utilized for high-performance electronic component manufacturing.

Compared to traditional SMT (Surface Mount Technology), BGA significantly enhances pin density, reduces thermal resistance, and greatly improves overall electrical performance.

Key Steps

Solder Paste Printing

Precisely applying solder paste patterns onto PCB pads.

Component Placement

Using automated pick-and-place machines to accurately position BGA chips onto the PCB.

Reflow Soldering

Carefully controlling the temperature profile to melt solder balls, leveraging surface tension for precise auto-alignment.

Quality Inspection

Utilizing X-ray and Automated Optical Inspection (AOI) to ensure every joint is robust and reliable.

BGA Assembly & Rework Services

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Quality & Inspection

Industry Application

We understand each industry's unique requirements and are ready to tackle your most complex technical challenges.

FAQs

We can handle virtually all BGA types, including PBGA, CBGA, µBGA, FCBGA, WLCSP, and stacked BGA.

Our equipment supports precision BGA assembly down to a minimum pitch of 0.25 mm.

Yes, we offer professional BGA reballing and rework services, including solder ball replacement, solder joint repair, and PCB pad refurbishment.

We employ advanced X-ray inspection equipment to visualize and ensure the integrity of solder joints beneath BGA chips.

Standard projects typically complete within 5-7 days. Quick-turn prototypes can be finished in as little as 24 hours, depending on complexity.

Absolutely! We specialize in prototype and low-volume orders and offer customized solutions for rapid prototyping.

Yes, our engineers offer comprehensive DFM reviews to optimize your PCB layout, pad design, and solder mask for the best production results.

Our processes strictly follow IPC-A-610 Class II and III standards and are ISO9001 certified, ensuring consistent high quality.

Yes, we recommend and frequently utilize ENIG finishes with NSMD pads for optimal solderability and reliability.

Of course! We provide detailed AOI and X-ray inspection reports with every project to ensure complete transparency and traceability.

Customer Reviews

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