BGA PCB Assembly Services
Precision BGA Soldering & Assembly for Complex Designs
As a trusted provider of BGA assembly services in China, we specialize in high-precision BGA soldering and assembly for advanced PCB designs. From prototypes to production, upload your Gerbers and BOM now for a quick, accurate quote.
What is BGA Assembly?

BGA (Ball Grid Array) assembly is an advanced surface-mount technology widely utilized for high-performance electronic component manufacturing.
Compared to traditional SMT (Surface Mount Technology), BGA significantly enhances pin density, reduces thermal resistance, and greatly improves overall electrical performance.
Key Steps
Solder Paste Printing
Precisely applying solder paste patterns onto PCB pads.
Component Placement
Using automated pick-and-place machines to accurately position BGA chips onto the PCB.
Reflow Soldering
Carefully controlling the temperature profile to melt solder balls, leveraging surface tension for precise auto-alignment.
Quality Inspection
Utilizing X-ray and Automated Optical Inspection (AOI) to ensure every joint is robust and reliable.
BGA Assembly & Rework Services
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Quality & Inspection
Industry Application
We understand each industry's unique requirements and are ready to tackle your most complex technical challenges.
FAQs
What types of BGA packages can you handle?
We can handle virtually all BGA types, including PBGA, CBGA, µBGA, FCBGA, WLCSP, and stacked BGA.
What's the smallest BGA pitch you can reliably assemble?
Our equipment supports precision BGA assembly down to a minimum pitch of 0.25 mm.
Do you provide BGA reballing and rework services?
Yes, we offer professional BGA reballing and rework services, including solder ball replacement, solder joint repair, and PCB pad refurbishment.
How do you ensure the quality of solder joints in hidden areas under the BGA?
We employ advanced X-ray inspection equipment to visualize and ensure the integrity of solder joints beneath BGA chips.
What's your typical turnaround time for BGA assembly projects?
Standard projects typically complete within 5-7 days. Quick-turn prototypes can be finished in as little as 24 hours, depending on complexity.
Can you handle small-volume prototype orders?
Absolutely! We specialize in prototype and low-volume orders and offer customized solutions for rapid prototyping.
Do you provide DFM (Design for Manufacturability) reviews?
Yes, our engineers offer comprehensive DFM reviews to optimize your PCB layout, pad design, and solder mask for the best production results.
What certifications and standards do your services comply with?
Our processes strictly follow IPC-A-610 Class II and III standards and are ISO9001 certified, ensuring consistent high quality.
Do you support special surface finishes like ENIG for BGA pads?
Yes, we recommend and frequently utilize ENIG finishes with NSMD pads for optimal solderability and reliability.
Can you provide inspection reports and documentation for quality assurance?
Of course! We provide detailed AOI and X-ray inspection reports with every project to ensure complete transparency and traceability.
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