BGA PCB Assembly Services

Precision BGA Soldering & Assembly for Complex Designs

As a trusted provider of BGA assembly services in China, we specialize in high-precision BGA soldering and assembly for advanced PCB designs. From prototypes to production, upload your Gerbers and BOM now for a quick, accurate quote.

What is BGA Assembly?

BGA (Ball Grid Array) assembly is an advanced surface-mount technology widely utilized for high-performance electronic component manufacturing.

Compared to traditional SMT (Surface Mount Technology), BGA significantly enhances pin density, reduces thermal resistance, and greatly improves overall electrical performance.

Key Steps

Solder Paste Printing

Precisely applying solder paste patterns onto PCB pads.

Component Placement

Using automated pick-and-place machines to accurately position BGA chips onto the PCB.

Reflow Soldering

Carefully controlling the temperature profile to melt solder balls, leveraging surface tension for precise auto-alignment.

Quality Inspection

Utilizing X-ray and Automated Optical Inspection (AOI) to ensure every joint is robust and reliable.

BGA Assembly & Rework Services

Supported BGA Types

Technical Capabilities & Specifications

Minimum Pitch Capability: Our advanced assembly processes handle pitches down to 0.25mm, ideal for high-density, high-precision applications.
Advanced Placement Equipment: Fully automated SMT pick-and-place machines ensure accurate, reliable component placement.
Controlled Reflow Soldering Processes: Professional temperature profiling ensures superior solder joint quality and reliability.
ESD & Temperature-Controlled Environment: All assembly processes are carried out in strictly controlled anti-static, temperature and humidity environments, safeguarding your sensitive electronic components.

Rework & Reballing Services

Solder joint repair and component replacement for BGA chips.
Precise solder ball reattachment (reballing), accurately restoring original solder layouts.
PCB pad repair and cleaning, extending the lifespan of your circuit boards.

Products Show

Quality & Inspection

AOI

We utilize state-of-the-art Automated Optical Inspection (AOI) systems with high-precision visual recognition technology to swiftly identify placement deviations, solder defects, and solder joint quality issues, significantly reducing potential failure risks.

Rapid and accurate detection of component misplacement and missing components.
Enhanced early-stage defect identification, reducing rework costs.

X-Ray Inspection

Since BGA solder joints are hidden beneath components, we employ high-resolution X-ray non-destructive inspection equipment to visually assess solder joint internal structures, ensuring joints are free of voids, cracks, or inadequate soldering.

Precise identification of minute internal defects within solder balls.
Detailed X-ray inspection reports provided to customers, ensuring transparent and traceable production.

DFM Review

To ensure smooth production of your project, our professional engineering team provides comprehensive Design for Manufacturability (DFM) reviews, covering pad dimensions, solder-mask openings, and soldering process optimization, effectively reducing design flaws and minimizing production risks.

Expert guidance on optimal BGA pad designs, recommending ENIG finishes and NSMD pads.
Reduced production costs and increased first-pass yield rates.

Certification System

We strictly adhere to international standards such as IPC-A-610 and ISO9001 in our production and inspection processes, ensuring every BGA assembly step meets regulatory requirements and client specifications.

Compliance with IPC-A-610 Class II and III standards (commercial and military-grade).
ISO9001 Quality Management System certified, continuously guaranteeing consistent quality.

Industry Application

We understand each industry's unique requirements and are ready to tackle your most complex technical challenges.

FAQs

What types of BGA packages can you handle?

We can handle virtually all BGA types, including PBGA, CBGA, µBGA, FCBGA, WLCSP, and stacked BGA.

What's the smallest BGA pitch you can reliably assemble?

Our equipment supports precision BGA assembly down to a minimum pitch of 0.25 mm.

Do you provide BGA reballing and rework services?

Yes, we offer professional BGA reballing and rework services, including solder ball replacement, solder joint repair, and PCB pad refurbishment.

How do you ensure the quality of solder joints in hidden areas under the BGA?

We employ advanced X-ray inspection equipment to visualize and ensure the integrity of solder joints beneath BGA chips.

What's your typical turnaround time for BGA assembly projects?

Standard projects typically complete within 5-7 days. Quick-turn prototypes can be finished in as little as 24 hours, depending on complexity.

Can you handle small-volume prototype orders?

Absolutely! We specialize in prototype and low-volume orders and offer customized solutions for rapid prototyping.

Do you provide DFM (Design for Manufacturability) reviews?

Yes, our engineers offer comprehensive DFM reviews to optimize your PCB layout, pad design, and solder mask for the best production results.

What certifications and standards do your services comply with?

Our processes strictly follow IPC-A-610 Class II and III standards and are ISO9001 certified, ensuring consistent high quality.

Do you support special surface finishes like ENIG for BGA pads?

Yes, we recommend and frequently utilize ENIG finishes with NSMD pads for optimal solderability and reliability.

Can you provide inspection reports and documentation for quality assurance?

Of course! We provide detailed AOI and X-ray inspection reports with every project to ensure complete transparency and traceability.

Customer Reviews

"Exceptional quality and precision! Their BGA assembly expertise was instrumental in successfully launching our avionics project ahead of schedule."

"We consistently rely on their team for our critical medical PCB assemblies. Their accuracy, professionalism, and fast response times are unmatched."

"Outstanding rework services! They helped us quickly resolve complex BGA issues, significantly reducing downtime and costs."

"Their DFM feedback improved our PCB designs dramatically, resulting in higher yields and fewer production delays. Highly recommend!"

"Reliable, precise, and responsive. Their BGA assembly service exceeded our expectations, helping us confidently scale our data center hardware."

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