Heavy Copper PCB (2–20oz): boost power handling, cooling, and reliability. Get clear design tips, current-capacity guidance, and manufacturer capabilities for high-current builds.
Learn how to choose PCB dielectric stackup—single vs. multi prepreg—using pressed thickness, resin content, and glass style to control impedance, cost, and manufacturability.
Learn how copper foil roughness drives GHz signal loss in high-speed PCBs. Clear skin-effect primer, Df test highlights, and practical fixes—use low-profile or RTF foils to cut insertion loss.
Quick guide to choosing copper foil for high-density PCBs: HTE, low-roughness, RTF and resin-specific foils to boost reliability, yield, and high-speed signals.
Dielectric constant and permittivity: Learn Dk vs Df, why FR-4 and Teflon differ, and how to pick low-loss PCB materials for reliable high-speed designs.
Choose the right PCB materials fast — FR-4, high-Tg, low-loss laminates, BT, PPO or polyimide. Compare Tg, Dk/Df, T260/T288 and get practical DFM tips for prototypes.
Discover how modern copper foil (ED, DSTF/RTF, rolled-annealed) shapes PCB performance—covering purity, resistivity, adhesion and specialty foils (resistive, ultra-thin) for high-density and flexible designs.
