| Type | Rigid-Flex PCB |
| The smallest device package | 0201
Device mounting with QFN theme |
|
Expansion and contraction ratio of soft board |
Adjust the optimal furnace temperature |
|
Advantage |
Ensuring that the appearance of the flexible board does not expand or shrink after mounting, improving the mounting accuracy. |
This Rigid-Flex PCB is purpose-built for high-precision medical electronics, balancing mechanical flexibility with dense component integration. Designed to support both ultra-miniature and complex package types, it ensures excellent dimensional stability and mounting accuracy under real-world production conditions.
Miniature Components: Supports 0201 package size for ultra-compact layouts.
Complex Mounting: Integrates QFN device mounting with high thermal and positional accuracy requirements.
Thermal Control: Trial production used to calculate flex board expansion/contraction rate, enabling optimization of reflow furnace profiles.
Dimensional Stability: Adjusted temperature curves eliminate warping or shrinkage post-reflow, critical for FPC mounting precision.
Application: Ideal for space-constrained and mechanically dynamic areas in advanced medical devices such as surgical tools, wearable monitors, and implantable electronics.
To maintain reliability and assembly precision, the following requirements are critical:
Design Inputs: Flexible-rigid stack-up design, Gerber files, material specs, and expansion coefficient data.
Soldering Process: Custom reflow profiles based on FPC material thermal behavior to reduce warping and misalignment.
Component Handling: High-accuracy placement systems required for 0201 and QFN devices.
Inspection Criteria: Optical inspection (AOI), X-ray for hidden joints (QFN), and visual inspection for board deformation.
Environmental Controls: Strict control of humidity and thermal cycling in both storage and production stages.
Q1: What makes rigid-flex PCBs ideal for medical applications?
A1: Rigid-flex designs combine flexibility with structural support, enabling compact and reliable connections in tight, moving, or body-conforming medical devices.
Q2: How do you prevent the flexible board from expanding or shrinking during soldering?
A2: Through trial production, we calculate the thermal expansion rate and fine-tune the reflow oven’s temperature profile to maintain dimensional accuracy.
Q3: What are the challenges of mounting 0201 and QFN components?
A3: These packages require extreme precision in solder paste printing, placement, and reflow to avoid defects like tombstoning or voiding. Advanced AOI and X-ray inspection are used to ensure success.
Q4: Can this board be customized for implantable or wearable devices?
A4: Yes. The material stack-up, size, and shape of the board can be fully customized to meet the requirements of wearable or minimally invasive medical products.
Q5: What is the typical production lead time?
A5: Standard production time ranges from 3–5 weeks, depending on design complexity and material availability.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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