| Layers | 18L（4R+10F+4R） |
| Thicknes | 2.1±0.02mm |
| Size | 287.88*421.05mm |
| Min. Buried Via/PAD
Min. Distance from Via to Line |
0.4mm/1.0mm
0.3mm |
| Hole Wall Copper Thickness
Surface Treatment |
30um
ENIG |
| ARLON PI Material Special Control during Lamination
Applications |
Impedance Control
Mother Board of Aerial Tanker Control System |
This 18-layer Rigid-Flex PCB (4R + 10F + 4R) is engineered for mission-critical aerospace applications, specifically used in the motherboard of an aerial tanker control system. With a precise total thickness of 2.1±0.02mm and dimensions of 287.88mm x 421.05mm, it combines structural rigidity with the routing flexibility needed in compact, high-density designs.
The board features fine buried via and pad tolerances (0.4mm/1.0mm), controlled impedance of 50±10%, and high-reliability ENIG surface treatment. Special process controls are applied during lamination to manage ARLON polyimide materials, ensuring thermal stability and long-term reliability under extreme operating conditions.
Specifications:
Type: Rigid-Flex PCB
Layers: 18 (4R + 10F + 4R)
Thickness: 2.1±0.02mm
Size: 287.88mm x 421.05mm
Min. Buried Via / PAD: 0.4mm / 1.0mm
Min. Distance from Via to Trace: 0.3mm
Hole Wall Copper: 30μm
Impedance: 50±10%
Surface Finish: ENIG
Material: ARLON Polyimide with Controlled Lamination Process
Application: Aerospace – Aerial Tanker Control System Motherboard
To ensure the highest performance and manufacturability of this complex Rigid-Flex PCB, the following requirements must be considered during the design and production phase:
Layer Stack-up Clarity: Provide a detailed stack-up file indicating rigid and flex zones with impedance layer mapping.
Material Call-Out: Specify high-temp ARLON PI material explicitly in the BOM and design notes.
Flex Routing: Avoid sharp corners and allow for sufficient bend radius, especially in flex-to-install zones.
Via Management: Blind/buried via structures must meet IPC-6013 Class 3A standards for aerospace.
Thermal Stress Simulation: For aerospace use, consider FEA validation or thermal cycle simulation data in design validation.
Documentation: IPC-2223-compliant drawings and clear lamination stage instructions are required.
Q1: Why is ARLON PI material used in this Rigid-Flex PCB?
A1: ARLON polyimide materials provide excellent thermal resistance, dimensional stability, and electrical performance — making them ideal for aerospace environments where temperature cycling and reliability are critical.
Q2: What challenges does the 18-layer Rigid-Flex structure pose?
A2: Complex lamination cycles, precision alignment between rigid and flexible zones, and managing warpage are key challenges. Our manufacturing process includes special lamination controls to ensure structural integrity and performance.
Q3: Can impedance values be customized?
A3: Yes, we support custom impedance tuning. Please specify your target impedance and reference layer configuration during the design phase.
Q4: How do you ensure via reliability in aerospace environments?
A4: We follow Class 3A standards with high copper plating thickness (≥30μm) and use strict via-hole integrity testing including thermal shock and cross-section analysis.
Q5: What is the typical lead time for such a complex PCB?
A5: Lead times vary based on design complexity and validation needs. For this 18-layer Rigid-Flex board, the typical production cycle is 20–25 working days, subject to DFM review.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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