| Type | Medical Electronics Motherboard |
| Size | 250*250mm |
| Intel FBGA processor | The minimum ball pitch of 0.35mm |
| The Micron memory of FBGA | The ball pitch of 0.4mm |
| High-density pins | Multiple FPC interfaces |
| Equipment | The use of a 12-temperaturezone nitrogen reflow soldering perfectly ensures the soldering quality of the precise and difficult devices of this board. |
This high-performance Medical Electronics Motherboard is specifically designed to support the stringent demands of advanced medical devices. With a board size exceeding 250×250mm, it integrates precision components and fine-pitch packaging to ensure superior computing power, stability, and soldering reliability.
Processor: Equipped with an Intel FBGA processor (0.35mm ball pitch) for high-speed data processing.
Memory: Utilizes Micron FBGA memory (0.4mm ball pitch) for reliable storage and system performance.
Connectivity: Includes multiple high-density FPC interfaces to accommodate complex peripheral integration.
Manufacturing Process: Leveraging 12-zone nitrogen reflow soldering to ensure consistent soldering quality, especially for fine-pitch and sensitive components.
Application: Ideal for use in diagnostic imaging, patient monitoring, and surgical navigation systems.
To achieve optimal compatibility and quality, the following requirements apply to the design and assembly process:
Design Inputs: Gerber files, BOM, Pick & Place files, 3D mechanical drawings, and test procedures.
Component Standards: All key components must comply with IEC 60601 and, where applicable, ISO 13485 guidelines.
Manufacturing Standards: Use of controlled environments and high-precision assembly processes to meet medical-grade reliability.
Soldering Quality: Must pass X-ray inspection and AOI for all fine-pitch BGA components.
Testing Protocols: Mandatory full-function testing and thermal cycling validation for high-reliability assurance.
Q1: What makes this motherboard suitable for medical applications?
A1: It is designed and manufactured to meet IEC 60601 requirements, featuring high-precision soldering, medical-grade components, and robust interface support for medical equipment.
Q2: Why use nitrogen reflow soldering with 12 temperature zones?
A2: Nitrogen reflow improves solder joint integrity, reduces oxidation, and provides uniform temperature control—critical for soldering high-density BGA and fine-pitch components.
Q3: Can this board be customized for different medical device applications?
A3: Yes. We offer full customization of layout, interfaces, and component selection to meet specific application needs.
Q4: What inspection methods are used during production?
A4: Each board undergoes Automated Optical Inspection (AOI), X-ray inspection, and functional testing to ensure zero-defect delivery.
Q5: What is the typical lead time for production?
A5: Standard production time ranges from 3–5 weeks depending on design complexity and component availability.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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