| Type | Flexible board |
| Layers | 2 |
| Drill Aspect Ratio | 4.0 |
| Surface Treatment | ENIG |
| Impedance | 100±10% |
| Size
Applications |
180mm x 100mm
Industrial control |
| Type | Flexible board |
| Layers | 2 |
| Drill Aspect Ratio | 4.0 |
| Surface Treatment | ENIG |
| Impedance | 100±10% |
| Size
Applications |
180mm x 100mm
Industrial control |
This 2-layer flexible printed circuit board (FPC) is designed for precision and durability in demanding industrial control applications. It features a drill aspect ratio of 4.0, ensuring excellent mechanical performance even in compact designs. The ENIG (Electroless Nickel Immersion Gold) surface treatment enhances solderability and corrosion resistance, making it ideal for long-term reliability. With impedance control of 100±10%, this board is optimized for signal integrity in high-speed or sensitive electronic environments.
Specifications:
Type: Flexible board
Layers: 2
Drill Aspect Ratio: 4.0
Surface Treatment: ENIG
Controlled Impedance: 100±10%
Dimensions: 180mm x 100mm
Application: Industrial control systems
To ensure the best performance and manufacturability, please consider the following requirements when designing for or ordering this flexible PCB:
Design Files: Gerber format with clear layer stack-up and impedance specifications
Bend Radius: Maintain a minimum bend radius of 6x the board thickness for durability
Component Placement: Avoid placing components on bend areas
Stiffeners (if needed): Specify regions where rigidity is required
Test Points: Include adequate test points for functional testing
Q1: Can this flexible board handle repeated bending in dynamic applications?
A1: While it is designed for flexibility, this specific board is optimized for static bend environments typical of industrial control applications. For dynamic flexing, a different stack-up or material set may be recommended.
Q2: Is ENIG the only surface finish option available?
A2: For this case study, ENIG is used to highlight its reliability benefits, but other finishes like OSP or immersion silver can be discussed depending on your application needs.
Q3: Can impedance be customized for different signal requirements?
A3: Yes, impedance can be tuned during the design phase. Please provide your desired impedance value, and we will adapt the trace width and stack-up accordingly.
Q4: Are there limitations on board size or layer count for flexible designs?
A4: While this case features a 2-layer board at 180mm x 100mm, we support flexible designs with various sizes and up to 6 layers. Please contact us for custom configurations.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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