| Type | Communication Module Board |
| Process | The strict stencil printing process |
|
Quality control |
Ensures the welding quality of the module |
|
Advantage |
The through rate reaches more than 99.5% |
| Type | Communication Module Board |
| Process | The strict stencil printing process |
|
Quality control |
Ensures the welding quality of the module |
|
Advantage |
The through rate reaches more than 99.5% |
This Communication Module Board is designed for high-performance data transmission and signal processing in medical and industrial applications. Utilizing a precision stencil printing process, it ensures exceptional soldering quality and assembly consistency, delivering a remarkable production yield rate exceeding 99.5%.
Advanced stencil printing guarantees uniform solder paste deposition for fine-pitch and micro-scale components.
Optimized process control and inspection enable a >99.5% first-pass yield rate.
Suitable for use in medical communication interfaces, IoT modules, and embedded wireless systems.
Built to support high-frequency, low-noise performance with stable signal integrity.
Every board undergoes strict soldering quality checks, including AOI and functional tests.
To maintain performance and reliability in communication-critical systems, the following design and process standards are required:
Gerber files, BOM, stencil design (with aperture ratio data), Pick & Place files, and layout constraints.
Tight control of solder paste viscosity, stencil thickness, and printing alignment.
Automated Optical Inspection (AOI) and optional X-ray for modules with hidden solder joints.
Temperature- and humidity-controlled assembly environment for process consistency.
Use of RoHS-compliant materials and alignment with IPC-A-610 Class 2 or higher.
Q1: What is stencil printing and why is it critical for module boards?
A1: Stencil printing is the process of depositing solder paste on pads before component placement. For communication modules with fine-pitch pads, it ensures precise solder volume, critical for reliable connections.
Q2: What contributes to the >99.5% yield rate?
A2: The combination of controlled stencil printing, consistent solder paste quality, and real-time inspection systems ensures a high first-pass assembly yield.
Q3: Can this board be used in wireless medical devices?
A3: Yes. It is ideal for wireless communication modules integrated into patient monitoring, wearable medical devices, and diagnostic tools.
Q4: How is soldering quality verified?
A4: Each unit undergoes AOI, and for complex packages, X-ray inspection is used to ensure complete and void-free solder joints.
Q5: What is the typical lead time for producing this module board?
A5: Lead times range from 2 to 4 weeks depending on complexity, customization, and component availability.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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