Type Rigid-Flex PCB The smallest device package 0201 Device mounting with QFN theme Expansion and contraction ratio of soft board Adjust the optimal furnace temperature Advantage Ensuring that the appearance of the flexible board does not expand or shrink after mounting, improving the mounting accuracy.

  Type  Communication Module Board Process  The strict stencil printing process Quality control  Ensures the welding quality of the module Advantage  The through rate reaches more than 99.5%

  Type  Medical Electronics Motherboard Size  250*250mm Intel FBGA processor  The minimum ball pitch of 0.35mm The Micron memory of FBGA  The ball pitch of 0.4mm High-density pins  Multiple FPC interfaces Equipment The use of a 12-temperaturezone nitrogen reflow soldering perfectly ensures the soldering quality of the precise and difficult devices of this board.

  Type  Medical Electronics Test Board Standard  Strictly implement the IEC60601 standard for medical electronics Advantage  Strictly require quality inspection and control Test  Guaranteed 100% X-ray welding stability.

  Type  Automotive Electronic Control Board Size  250*250mm Standard  Ensuring the implementation of the standards of IPC J-STD-001H/IPC-A-610 HA automotive electronics Material  Using high-quality imported high-purity precious metal solder Advantage  Ensure the stability and reliability of solder joints.

  Type  Multilayer PCB Layers  32L Width/space  2.7mil/3mil Minimum back drilling diameter Thicknes  0.20mm 4.415+0.46/-0.42mm Size Aspect Ratio  282mm x 750mm 22 Surface Treatment Special Process Applications  OSP Single-sided impedance 54Ω±10%, Differentialimpedance 93+7/-8Ω Communication