IPC-4101 PCB Laminate Identification: Key Parameters and Inspection Checklist
Learn how to perform accurate PCB laminate identification using IPC-4101 standards. Discover key inspection points, common errors, and expert tips to ensure quality and compliance in your PCB manufacturing process.
Solder Mask and Silkscreen Process
Discover how solder mask and silkscreen layers impact PCB reliability. This guide covers essential process steps, design best practices, and how to prevent common issues like pad misalignment and silkscreen overlap.
Glass Transition Temperature (Tg) in PCB Materials: Why It Matters and How to Choose the Right One
Discover what Glass Transition Temperature (Tg) means in PCB materials, why it’s critical for thermal reliability, and how to choose the right Tg for your circuit board design. Learn about Tg ranges, measurement methods (DSC, DMA, TMA), and the benefits of high-Tg PCBs in high-temperature applications.
A Detailed Through-hole soldering Tutorial: Step‑by‑Step Guide, Tips & Troubleshooting
Learn how to solder through-hole components with this detailed, beginner-friendly tutorial. Discover essential tools, step-by-step instructions, expert tips, and common soldering mistakes to avoid for stronger, more reliable PCB connections.
Prototype PCB Assembly: Manual Tools and Low-Volume Tips
Learn how to assemble prototype PCBs using manual tools and low-volume techniques. This practical guide covers soldering tips, desktop equipment recommendations, and step-by-step workflows to help engineers and makers build and validate boards quickly and cost-effectively.
What is SMT? A Complete Guide to Surface Mount Technology
SMT (Surface Mount Technology) is a widely used method for mounting components directly onto PCB surfaces. This guide provides an overview of SMT's process, benefits, and common challenges in modern electronics manufacturing.
What Is Solder Mask? Materials, Design Rules & Reliability Guide for PCB Engineers
Learn what solder mask is, why it's essential in PCB manufacturing, and how to choose the right type for your application. This in-depth guide covers materials, design rules, common defects, and reliability tips to help engineers create high-performance circuit boards.
What is Solder Paste Inspection (SPI)? – How 3D SPI Improves SMT Assembly Yield
Discover what Solder Paste Inspection (SPI) is, how 3D SPI outperforms 2D systems, and why it’s essential for boosting SMT yield, reducing defects, and enabling smart factory integration.
PCB Drilling and Plated Through Holes
Learn everything about PCB drilling and plated-through holes—including drilling methods, plating processes, quality factors, common defects, and DFM guidelines to avoid manufacturing issues.
Flying Probe Testing 101: A Flexible PCB Testing Method for Prototypes and Low-Volume Runs
Flying Probe Testing offers a fast, fixture-free solution for prototype and low-volume PCB testing. Learn how it works, when to use it, cost benefits, design tips, and how it compares to traditional methods—all in one expert guide.
An Invitation Letter from Iran
Fast Turn PCB will participate in Iran Elecomp 2025, held this September in Tehran, Iran. As a key electronics trade fair in the Middle East, Iran Elecomp gathers industry professionals across the entire electronics value chain — from components to production and system integration. At the event, Fast Turn PCB will showcase featured PCB samples […]
Inner Layer Imaging and Lamination
Learn how inner layer imaging and lamination shape the quality and reliability of multilayer PCBs. This expert guide covers photoresist patterning, etching, material shrinkage, stack-up design, and process control—essential for engineers optimizing multilayer board performance.