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Definitive HDI PCB Guide: Design, DFM Rules & Manufacturing for High-Density Boards

HDI PCB stackups: 1+N+1, 2+N+2, and Any-Layer with microvias

Master HDI PCB design: stack-ups, DFM rules, microvia & via-in-pad best practices, reliability checks, and cost-saving tips for volume manufacturing.

Copper Foil Roughness in High-Speed PCBs: How It Causes GHz Signal Loss — and What to Do

Lines from 0–20 GHz showing higher loss for rough foils (JTCSHP) and lower loss for rolled foil.

Learn how copper foil roughness drives GHz signal loss in high-speed PCBs. Clear skin-effect primer, Df test highlights, and practical fixes—use low-profile or RTF foils to cut insertion loss.

Choosing the Best Copper Foil for High-Density PCBs: HTE, Low-Roughness & Reliability Explained

Side-by-side cross-sections showing standard foil vs reverse-treated foil (RTF) at ~100 μm scale.

Quick guide to choosing copper foil for high-density PCBs: HTE, low-roughness, RTF and resin-specific foils to boost reliability, yield, and high-speed signals.

Increase PCB Wiring Density: 3 HDI Strategies for Better Yield & Performance

PCB wiring density graphic showing copper roughness (standard vs ULP) and insertion loss vs frequency

Discover 3 HDI strategies—fine-line etching, extra layers, and microvias—to increase PCB wiring density while maintaining yield and high-frequency performance.

Dielectric Constant and Permittivity: PCB Dk & Df for FR-4, Teflon

Schematic diagram of dielectric constant measurement with capacitor plates and dielectric material.

Dielectric constant and permittivity: Learn Dk vs Df, why FR-4 and Teflon differ, and how to pick low-loss PCB materials for reliable high-speed designs.

UL 94 V-0 / V-1 / V-2 for PCBs: Flammability Test Rules & How to Pass

UL 94 flammability vertical burn test setup with 0.5×5 in specimen above a 0.75 in blue flame

Clear guide to UL 94 V-0/V-1/V-2 for PCBs: flammability criteria, test steps, material choices, and a checklist to help your board pass certification.

PCB Materials Guide: How to Choose FR-4, Low-Loss, BT, PPO & Polyimide

PCB Materials

Choose the right PCB materials fast — FR-4, high-Tg, low-loss laminates, BT, PPO or polyimide. Compare Tg, Dk/Df, T260/T288 and get practical DFM tips for prototypes.

Ceramic PCB: AlN vs Al₂O₃ — Thermal Performance, Cost & When to Use

Ceramic PCB heat flow cutaway

Learn how ceramic PCB (AlN vs Al₂O₃) outperforms FR-4 and aluminum in thermal, RF, and high-reliability apps — a clear selection guide with key specs.

Aluminum PCB Guide: MCPCB Thermal Design for LED Drivers & Ballasts

3D cutaway of MCPCB showing copper layer, dielectric, aluminum base, and heat flow to heatsink

Aluminum PCB (MCPCB) guide: structure, thermal path, failures, and assembly tips for LED drivers & ballasts. Design cooler, build longer-lasting products.

FR4 PCB Guide: Key Specs, Stack-Ups & When to Use Alternatives

Exploded view of FR4 PCB showing solder mask, copper foil, prepreg, and core layers

Learn what FR4 PCB is, key specs, stack-up tips, when to use aluminum or low-loss laminates, and a practical selection checklist for reliable designs.

PCB Board Material Guide: FR-4 vs Ceramic vs Aluminum — How to Choose

PCB board material comparison showing FR-4, ceramic, and aluminum IMS stack-ups with copper layers

Learn how to choose the right PCB board material — FR-4, ceramic (AlN/Al₂O₃) or aluminum. Compare Tg, Dk/Df, copper weight and real-world use cases.

Copper Foil for PCBs: Types, Properties, and How to Choose for High-Frequency & Flexible Boards

S-shaped flexible PCB with copper foil surface texture and low-profile inset

Discover how modern copper foil (ED, DSTF/RTF, rolled-annealed) shapes PCB performance—covering purity, resistivity, adhesion and specialty foils (resistive, ultra-thin) for high-density and flexible designs.

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