| Type | Multilayer PCB |
| Layers | 32L |
| Width/space | 2.7mil/3mil |
| Minimum back drilling diameter
Thicknes |
0.20mm
4.415+0.46/-0.42mm |
| Size
Aspect Ratio |
282mm x 750mm
22 |
| Surface Treatment
Special Process Applications |
OSP
Single-sided impedance 54Ω±10%, Differentialimpedance 93+7/-8Ω Communication |
This high-performance 32-layer multilayer PCB is engineered for demanding communication applications that require complex signal integrity and tight impedance control. With ultra-fine line/space (2.7mil/3mil), precise back drilling capabilities, and robust thickness control, this board delivers exceptional electrical and mechanical performance even in high-frequency environments.
Key Specifications:
PCB Type: Multilayer PCB
Number of Layers: 32
Board Dimensions: 282mm × 750mm
Board Thickness: 4.415mm (+0.46/-0.42mm)
Line Width / Spacing: 2.7mil / 3mil
Minimum Back Drilling Diameter: 0.20mm
Aspect Ratio: 22
Surface Finish: OSP (Organic Solderability Preservative)
Controlled Impedance:
Single-ended: 54Ω ±10%
Differential: 93Ω (+7/-8Ω)
Application Area: High-speed Communication Systems
To ensure successful fabrication and optimal performance, the following design and production criteria must be considered:
Design for Manufacturability (DFM): All Gerber and stack-up files must clearly define impedance requirements and drilling locations.
Impedance Tolerance: Maintain tight impedance specifications (±10%) for critical signal paths.
Back Drilling Accuracy: Precise drilling layer mapping is required to ensure reliability in high-speed signals.
OSP Handling: Use proper storage and assembly practices to protect the OSP surface prior to soldering.
Thermal Management: Consider material thermal conductivity due to the high layer count and board thickness.
Material Selection: Choose low-loss, high-Tg materials suited for high-frequency environments.
Q1: What is the main advantage of using a 32-layer PCB?
A: It allows for highly complex routing, better EMI performance, and separation of high-speed signals, power, and ground planes, essential in communication systems.
Q2: Why is impedance control critical in this board?
A: High-speed signals in communication devices require stable impedance to minimize signal distortion, crosstalk, and losses.
Q3: What challenges are associated with a 22:1 aspect ratio?
A: It demands precision in drilling and plating processes to maintain via reliability and overall board integrity.
Q4: Is back drilling essential?
A: Yes. Back drilling removes unused stubs from vias, which is crucial for signal integrity in high-speed designs.
Q5: Can this PCB be used in RF applications?
A: While it’s optimized for digital high-speed communication, with appropriate materials and layout, it can support certain RF applications as well.
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
Room 503, Building A03, Ping An Technology Silicon Valley, No. 76, Chuangyu Road, Ningxi Street, Zengcheng District, Guangzhou. 511358
1 Southwest Fifth Street, Dongguan City,China
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