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RO3003 special High Frequency Circuit Materials Immersion Silver advanced pcb circuit board fabrication

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RO3003 special High Frequency Circuit Materials Immersion Silver advanced pcb circuit board fabrication

Advanced RO3003 High Frequency Immersion Silver pcb circuit board manufacturing

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    Fast Turn PCB
Product Detail

    RO3003 special High Frequency Circuit  Materials Immersion Silver advanced pcb circuit board fabrication

  IPC 6012 CLASS 3  |   ISO 9001:2018   |   UL certificated  | RO3003 special material   |   Immersion Silver   



Fast Turn PCB is quick turn specialist in the multilayer pcb prototype.  For this RO3003 special High Frequency Circuit  Materials Immersion Silver advanced pcb circuit board fabrication. This is a special high frequency circuit material—RO3000® Series.  RO3000® High Frequency Circuit Materials are ceramic- filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.  RO3000® series laminates are PTFE-based circuit materials with mechanical properties that are consistant regardless of the dielectric constant selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.  The dielectric constant versus temperature of RO3000 series materials is very stable .  These materials exhibit a coefficient of thermal expansion (CTE) in the X and Y axis of 17 ppm/oC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage (after etch and bake) of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ C, which provides exceptional plated through-hole reliability, even in severe thermal environments.  RO3000® series laminates can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with minor modifications as described in the application note “Fabrication Guidelines for RO3000® Series High Frequency Circuit Materials.”


Available claddings are ½ , 1 or 2 oz./ft2 (17, 35, 70

µm thick) electrodeposited copper foil.

RO3000® laminates are manufactured under an ISO 9002 certified system.


Our multi-layer fabrication capabilities include a variety of specifications:

Multi-layer Circuit Board up to 36 Layers

Maximum Board Size: 23“ *35” 

PCB Thickness: 8-275mil

Minimum Track Width: 0.07mm (3mil)

Minimum Track Spacing: 0.07 mm (3mil)

Minimum drill hole diameter: 0.1 mm (4mil)

Via types : blind, buried and plugged, etc.

Special material: Rogers, megtron, Halogen free, etc

Surface finish: ENIG, HASL, HASL LF, Immersion Tin, Immersion silver and so on.


Quick turn printed circuit board Specifications:

Layer count : 2
Material : Rogers 3003
Thickness : 0.762mm
Surface Finish : Immersion Silver
copper Thickness:0.5OZ
board size:55*54.8MM


Main Application:


Products Process



Company Policies:



Customer Privacy Policy

A1. All information gathered from our dealings with fabrication orders are used strictly for our reference and would not be passed on to any third party.

A2. In the case where passing information is necessary to facilitate sub-contracting jobs to relevant party, we will inform our customer of such action.


Panelizing & Merging Policy

B1. For prototype Service, single design panelization and multiple designs panelization are both acceptable for Prototype Service.

B2. For production run, additional designs may be merged for additional cost for the special design correspondingly according to the design. We will give you advice before going to the fabrication.


Non-Disclosure Policy

C1. All engineering data passed on to us would be treated as confidential information and would protected as such. 

C2. In the case where passing information is necessary to facilitate sub-contracting jobs, we would request for advice prior to doing so. 



Return & Rework Policy

D1, All PCB made and sold are returnable for a refund if there is some problem caused by Fast Turn PCB.

D2. We accept request for remake/rework or replace for:

1.  PCB which is not built according to the given CAD or CAM files.

2. Jobs with with high level of fabrication defect.

3. Quantity received is not the quantity promised.

4. Quality issues.


Manufacturing Lead time Policy

E1. For the quick turn project, all orders accepted are counted by hours. Accept that, all the orders received in the afternoon at the local time, the lead time counts from the next day. 
E2. Orders accepted during holidays and weekend will be processed the next work day.


Our Customers:

We have been established a long-term partnership with many famous enterprises. The followings are our faithful partners: 


Delivery Cycle

Fast Turn PCB has been dedicated to quick turn pcb prototypes for more than 10 years. It can manufacture pcb boards with a fast turn time. For the singled-side or doubled-sided pcb board, we can make it within 24 hours. And for the 6-12 layer board, the fastest time can be 72 hours. And the OTD is up to 98% for the quick turn prototypes. 


Get reliable Quick turn PCB Manufacturing in China. Fast Turn PCB is your best quick turn printed circuit board manufacturer.



A free consultation

Email us with any questions or inquiries or use our contact data. We would be happy to answer your questions.

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