Fast Turn PCB INT'L Company Limited.

PCB layout design service

Rigid-Flex PCB

Capability

New Products

Our rigid-flex circuit board solutions are custom designed for many top tier OEMs to provide the optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components.  Manufactured with dependable reliability, our rigid-flexible circuits are built to withstand the rigors of aerospace, medical, and military applications. 

For the rigid-flex pcb, we have utilize advanced technologies and to create rigid-flex circuit boards of the best quality. We manufacture not just the regular 4, 6 layer rigid-flex, but also good at the multilayer rigid-flex boards up to 18 layer.


The following information outlines our engineering and manufacturing capabilities.

Rigid-Flex PCB Capability 

Items

Type

 Normal Manufacturing Capability

Standard Deliverable

Inspection Std.

IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3

Test Std.

IPC-TM-650,GB/T4677-2002

Material

DuPont

AL9111R, AP9121R, AP9131R, AP8525R

Panasonic

R-F775   11RB-M, R-F775   22RB-M, R-F775   21RB-M

Taiflex

NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520JY

No Flow PP

VT-47N,VT-901

CCL

ITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C ,85N

Board Spec.

Layers

 2-18

Thickness

 8-118mil

Max dimension

15.74X28 Inch

Min precision Of Dim

±4mil

Min diameter of holes

4mil (Laser drill); 6mil(mechanical drill)

Aspect ratio

16:1

Min trace width/space wtidth of gridding circr

5/5mil

Min trace width/space wtidth of outer layer

0.5OZ finished copper

3.0/3.0mil

1OZ finished copper

3.5/3.5mil

2OZ finished copper

5/5mil

Min trace width/space wtidth of inner layer

0.5OZ finished copper

3.5/3.5mil

1OZ finished copper

4/4mil

Min trace width/space wtidth of out layer

2OZ finishedcopper,Flex layer on top or bottom

5/5mil(1/3、1/2oz copper);6.5/5mil(1oz copper);8/5.5mil(2oz copper);

Min distance Between drilling&conductor

via holes

7mil(2layers);9mil(3~6Llayers);11mil(≥7layers)

omponent holes

10mil(2layers);12mil(3~6Llayers);14mil(≥7layers)

buried &blind holes

7mil

Min ring of inner layer

via holes

5mil(≤6 Layers);8mil(>8Layers)

component holes

8mil(≤6Layers);11mil(>8Layers)

Surface treatment

Plating Gold(Hard gold)

Normal:0.25-0.76um;Hard gold:0.76-2um;

ENIG

Ni:3--8um,Au:0.05-0.1um

Immersion Tin

0.80-1.20um

Immersion Silver

0.10-0.30um

0SP

0.15-0.30um

HASL

2-40um

HASL lead free

2-40um

Silver ink

10-25um

Selective surface finishing

ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.

Routing

Outline Tol.

 +/-4mil

others

The vias to the coalescent location of rigid and flex

1mm

HDI board

1+n+1


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