Via filling pcb

22 Layer via fill resin countersink solt Advanced PCB Circuit Board

Layer:22Material:FR4 TG170
Thickness:2.6mmMin. Line width & Space:3.5/3.5mil
Min.Hole size:0.25mmCopper thickness:0.5/1.0 OZ
Impedance control:YesLeading time;18 working days

For quotation, please contact James:+86- 18011866680

Send you gerber file to Email: [email protected]

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