Via filling pcb

22 Layer via fill resin countersink solt Advanced PCB Circuit Board

Layer: 22 Material: FR4 TG170
Thickness: 2.6mm Min. Line width & Space: 3.5/3.5mil
Min.Hole size: 0.25mm Copper thickness: 0.5/1.0 OZ
Impedance control: Yes Leading time; 18 working days

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