Pcb stacking
8 layer two stacked HDI three times laminations with ENIG PCB circuit Board Manufacturer
| Layer： | 8-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3；L1-3；L3-6；L6-8；L7-8 ) | ||
| Material： | FR4 TG170 | Thickness： | 1.6mm |
| Cooper thickness： | 35μm | Surface finish： | ENIG |
| Soldermask/Legend | Green/White | IPC Standard | IPC3 |
| Unit Size： | 118*25.3mm | ||
For quotation, please contact James:+86- 18011866680
Send you gerber file to Email: sales@fastturnpcbs.com
Some of our customers are as follows:
