Pcb stacking
8 layer two stacked HDI three times laminations with ENIG PCB circuit Board Manufacturer
Layer: |
8-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L1-3;L3-6;L6-8;L7-8 ) |
Material: |
FR4 TG170 |
Thickness: |
1.6mm |
Cooper thickness: |
35μm |
Surface finish: |
ENIG |
Soldermask/Legend |
Green/White |
IPC Standard |
IPC3 |
Unit Size: |
118*25.3mm |