Pcb stacking

8 layer two stacked HDI three times laminations with ENIG PCB circuit  Board Manufacturer

Layer:8-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L1-3;L3-6;L6-8;L7-8 )
Material:FR4 TG170Thickness:1.6mm
Cooper thickness:35μmSurface finish:ENIG
Soldermask/LegendGreen/WhiteIPC StandardIPC3
Unit Size:118*25.3mm

For quotation, please contact James:+86- 18011866680

Send you gerber file to Email: [email protected]

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