high density interconnect pcb with blind vias

10 layer two stacked HDI three times laminations with selective hard gold  fine circuit PCB Board Manufacturer

Layer: 10-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L3-8;L8-9;L9-10 )
Material:FR4 TG170Thickness:1.6mm±10%
Copper thickness:18/35μmSurface finish:Slective 30μ” Hard Gold + ENIG
Track Width&Gap3/3milSoldermask/LegendGreen/White
IPC Standard:IPC3Unit size:86x43mm
Array size:86x43mm(1-up)Minimum hole copper:25μm

For quotation, please contact James:+86- 18011866680

Send you gerber file to Email: [email protected]

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