high density interconnect pcb with blind vias

10 layer two stacked HDI three times laminations with selective hard gold  fine circuit PCB Board Manufacturer

Layer:  10-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L3-8;L8-9;L9-10 )
Material: FR4 TG170 Thickness: 1.6mm±10%
Copper thickness: 18/35μm Surface finish: Slective 30μ” Hard Gold + ENIG
Track Width&Gap 3/3mil Soldermask/Legend Green/White
IPC Standard: IPC3 Unit size: 86x43mm
Array size: 86x43mm(1-up) Minimum hole copper: 25μm

For quotation, please contact James:+86- 18011866680

Send you gerber file to Email: sales@fastturnpcbs.com

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