Blind And Buried vias pcb

6 layers HDI blind and buried board FR4 TG 170 impedance control board of custom HDI board prototype

Layer 6 Material FR4 TG170
Thickness 0.060″ Min.line width and space 5/5mil
Min.Hole size 8mil Surface Finish ENIG
Copper Thickness: 1 oz Impedance control Yes
Via filled Fill copper

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