Technology Goad
Technology Goad
Technology Roadmap | ||||||
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2018 | 2019 | 2020 | ||||
Minimum line width / space | Mass production | Proofing | Mass production | Proofing | Mass production | Proofing |
Maximum number of layers | 24 | 30 | 26 | 34 | 26 | 36 |
Minimum plate thickness | 0.3 | 0.2 | 0.3 | 0.2 | 0.3 | 0.2 |
Minimum copper thickness | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
Minimum laser hole | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
Maximum plate thickness aperture ratio | 16:01:00 | 18:01:00 | 18:01:00 | 20:01:00 | 20:01:00 | 22:01:00 |
Minimum via | 0.15 | 0.1 | 0.15 | 0.1 | 0.1 | 0.1 |
Impedance control | ±7 | ±7 | ±7 | ±5 | ±7 | ±5 |
RoHs certification | have | have | have | have | have | have |
Lead-free process | have | have | have | have | have | have |
Green material-H/F | have | have | have | have | have | have |
Copper-filled microvia | have | have | have | have | have | have |
HDI structure | 1+N+1 | 2+N+2 | 2+N+2 | 3+N+3 | 2+N+2 | 4+N+4 |
ELIC level | 10Floor | 12Floor | 12Floor | 14Floor | 14Floor | 14Floor |