Technology Goad

Technology Goad

Technology Roadmap
	2018		2019		2020
Minimum line width / space	Mass production	Proofing	Mass production	Proofing	Mass production	Proofing
Maximum number of layers	24	30	26	34	26	36
Minimum plate thickness	0.3	0.2	0.3	0.2	0.3	0.2
Minimum copper thickness	0.05	0.05	0.05	0.05	0.05	0.05
Minimum laser hole	0.1	0.1	0.1	0.1	0.1	0.1
Maximum plate thickness aperture ratio	16:01:00	18:01:00	18:01:00	20:01:00	20:01:00	22:01:00
Minimum via	0.15	0.1	0.15	0.1	0.1	0.1
Impedance control	±7	±7	±7	±5	±7	±5
RoHs certification	have	have	have	have	have	have
Lead-free process	have	have	have	have	have	have
Green material-H/F	have	have	have	have	have	have
Copper-filled microvia	have	have	have	have	have	have
HDI structure	1+N+1	2+N+2	2+N+2	3+N+3	2+N+2	4+N+4
ELIC level	10Floor	12Floor	12Floor	14Floor	14Floor	14Floor