Technology Goad
Technology Goad
| Technology Roadmap | ||||||
|---|---|---|---|---|---|---|
| 2018 | 2019 | 2020 | ||||
| Minimum line width / space | Mass production | Proofing | Mass production | Proofing | Mass production | Proofing |
| Maximum number of layers | 24 | 30 | 26 | 34 | 26 | 36 |
| Minimum plate thickness | 0.3 | 0.2 | 0.3 | 0.2 | 0.3 | 0.2 |
| Minimum copper thickness | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Minimum laser hole | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
| Maximum plate thickness aperture ratio | 16:01:00 | 18:01:00 | 18:01:00 | 20:01:00 | 20:01:00 | 22:01:00 |
| Minimum via | 0.15 | 0.1 | 0.15 | 0.1 | 0.1 | 0.1 |
| Impedance control | ±7 | ±7 | ±7 | ±5 | ±7 | ±5 |
| RoHs certification | have | have | have | have | have | have |
| Lead-free process | have | have | have | have | have | have |
| Green material-H/F | have | have | have | have | have | have |
| Copper-filled microvia | have | have | have | have | have | have |
| HDI structure | 1+N+1 | 2+N+2 | 2+N+2 | 3+N+3 | 2+N+2 | 4+N+4 |
| ELIC level | 10Floor | 12Floor | 12Floor | 14Floor | 14Floor | 14Floor |