PCB inner layer production process fully explained

1. Process classification Divided into single-sided, double-sided, and multilayer boards by the number of PCB layers, these three board processes are not quite the same. Single-sided and double-sided panels do not have an internal flow, it is basically an open-drill-follow-up process; Multi-layer boards will have an inner flow 1) Single panel process flow Cutting and…

Brief analysis of PCB board surface treatment process

I. PCB surface treatment Antioxidation, tin spray, lead-free tin spray, sink gold, sink tin, sink silver, hard gold plating, full board gold plating, gold finger, nickel palladium gold OSP: lower cost, good solderability, harsh storage conditions, short time, environmentally friendly process, good solder, flat. Spray tin: Spray tin boards are generally multi-layer (4-46 layers) high…

A text to read the PCB stack design

In general there are two main rules to follow for stacked design: 1. Each alignment layer must have an adjacent reference layer (power or ground); 2. The adjacent main power and ground layers are to be kept at a minimum distance to provide a large coupling capacitance. Here is an example of a stack from…