The device layout of the entire board is compact. The size of the processor is large, and the number of BGAsolder balls exceeds 1800 pins. The BGA bubble rate required by the customer has been successfully completed, and the through rate also remains above 98%.
The device layout of the entire board is compact. The size of the processor is large, and the number of BGAsolder balls exceeds 1800 pins. The BGA bubble rate required by the customer has been successfully completed, and the through rate also remains above 98%.
