Blind And Buried vias pcb
6 layers HDI blind and buried board FR4 TG 170 impedance control board of custom HDI board prototype
Layer |
6 |
Material |
FR4 TG170 |
Thickness |
0.060″ |
Min.line width and space |
5/5mil |
Min.Hole size |
8mil |
Surface Finish |
ENIG |
Copper Thickness: |
1 oz |
Impedance control |
Yes |
Via filled |
Fill copper |