Printed circuit board fabrication

8 layer fine line pcb with 30U” selective hard gold multilayer pcb circuit board manufacturing


Printed circuit board fabrication specification:

Layer: 8 Material: FR4 IT180A TG175
Thickness: 0.062″ Min.Line width: 3.8mil
Min.Hole size: 7.8mil Surface finish: ENIG+30 U” Selective hard gold
Thickness: 1 OZ Board size: 132.08*130.81MM
Impedance control: Yes Leading time: 8 working days


Some of our customers:

Product recommendation:


你的电子邮件地址不会被公开 * 为必填字段