ISOLA 370HR Material pcb stacking

12L three stacked four times laminations HDI with ENIG  fine circuit PCB Board Manufacturer

Rigid pcb Specifications:

Layer  12-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3;L3-4;L4-L9;L9-10;L10-L11;L11-L12;L1-L12 )
Material: ISOLA 370HR Thickness: 1.2mm
Copper thickness: 35μm Surface finish: ENIG
Track Width&Gap: 2.5/2.5mil Soldermast/Legend Green/White
IPC standard: IPC2 Unit size: 95mm*55mm
Impedance control: Yes Filled vias: Non-Conductive Resin

Product detail:

* For the 12 layer complex Blind& Buried Micro-Vias rigid PCB boards with Micro-Vias in L1-L2 、 L2-L3、L3-L4、L4-L9、L9-L10、L10-L11、L11-L12、L1-L12, we use ISOLA 370HR material in the rigid board to ensure the lamination process. In this way, the stability of quality is easily guaranteed.

*  Fine line:2.5/2.5mil line width


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