ISOLA 370HR Material pcb stacking
12L three stacked four times laminations HDI with ENIG fine circuit PCB Board Manufacturer
Rigid pcb Specifications:
| Layer | 12-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3；L3-4；L4-L9;L9-10;L10-L11;L11-L12;L1-L12 ) | ||
| Material: | ISOLA 370HR | Thickness: | 1.2mm |
| Copper thickness: | 35μm | Surface finish: | ENIG |
| Track Width&Gap: | 2.5/2.5mil | Soldermast/Legend | Green/White |
| IPC standard: | IPC2 | Unit size: | 95mm*55mm |
| Impedance control: | Yes | Filled vias: | Non-Conductive Resin |
Product detail：
* For the 12 layer complex Blind& Buried Micro-Vias rigid PCB boards with Micro-Vias in L1-L2 、 L2-L3、L3-L4、L4-L9、L9-L10、L10-L11、L11-L12、L1-L12, we use ISOLA 370HR material in the rigid board to ensure the lamination process. In this way, the stability of quality is easily guaranteed.
* Fine line:2.5/2.5mil line width
