HDI pcb manufacturing
10 layer Four stacked HDI Four times laminations with ENIG super thick 3.2mm board PCB Board Manufacturer.
HDi pcb Specifications:
|Layer：||10-layers PCB(with Blind & Buried Micro-Vias:L1-L2, L1-L3, L1-L4, L1-L5, L1-L6, L1-L7, L1-L8, L1-L9 )|
|Copper thickness：||35μm||Surface finish：||ENIG|
|Unit size:||203*178mm||Filled vias：||With resin|
* For the 10 layer complex Blind& Buried Micro-Vias rigid PCB boards with Micro-Vias in L1-L2, L1-L3, L1-L4, L1-L5, L1-L6, L1-L7, L1-L8, L1-L9, we choose HI TG FR4 in the rigid board to ensure the lamination process. In this way, the stability of quality is easily guaranteed.