HDI pcb manufacturing

10 layer Four stacked HDI Four times laminations with ENIG super thick 3.2mm board PCB Board Manufacturer.

HDi pcb Specifications:

Layer: 10-layers PCB(with Blind & Buried Micro-Vias:L1-L2, L1-L3, L1-L4, L1-L5, L1-L6, L1-L7, L1-L8, L1-L9 )
Material: FR4 G170 Thickness: 3.2mm
Copper thickness: 35μm Surface finish: ENIG
Soldermask/Legend Green/White IPC Standard IPC2
Unit size: 203*178mm Filled vias: With resin

Product detail:


* For the 10 layer complex Blind& Buried Micro-Vias rigid PCB boards with Micro-Vias in  L1-L2, L1-L3, L1-L4, L1-L5, L1-L6, L1-L7, L1-L8, L1-L9, we choose HI TG FR4  in the rigid board to ensure the lamination process. In this way, the stability of quality is easily guaranteed.

Get Quotation:sales@fastturnpcbs.com

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