Blind And Buried vias pcb

6 layers HDI blind and buried board FR4 TG 170 impedance control board of custom HDI board prototype

Buried vias pcb:

Layer 6 Material FR4 TG170
Thickness 0.060″ Min.line width and space 5/5mil
Min.Hole size 8mil Surface Finish ENIG
Copper Thickness: 1 oz Impedance control Yes
Via filled Fill copper

Product detail:

* The reliable material we use:We usually use IT 180A for TG 175 to replace the unreliable materials. For all regular FR4 boards, we just use Hi     TG material for manufacturing to ensure the quality and stability of the printed circuit boards.For the HDI boards, we usually use fill copper to fill with vias holes.


* The surface finish of the board is ENIG. And the surface is smooth on the green solder mask with white legend.


* This is a 2+N+2 HDI board with the Min. line width and space being 5/5mil. We can upmost manufacture the 4+N+4 HDI boards with 3/3mil.


Some of our customers:

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