Layers:8 | |||||
Material:Ro3003+FR 180 | |||||
Surface finish:ENIG | |||||
Board Thickness:1.2mm | |||||
Board size:0mm*0mm(0ups) | |||||
Copper Thickness:0.5oz |
Layers:8 | |||||
Material:Ro3003+FR 180 | |||||
Surface finish:ENIG | |||||
Board Thickness:1.2mm | |||||
Board size:0mm*0mm(0ups) | |||||
Copper Thickness:0.5oz | |||||
Solder mask:Red | |||||
Silkscreen:White | |||||
Impedance:Yes | |||||
Min hole wall:1 mil | |||||
IPC Standard:IPC Class 2 |
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